Studied on mechanical, thermal and dielectric properties of BPh/PEN-OH copolymer

Huang, Yumin; Luo, Yan; Xu, Mingzhen; Lei, Yangxue; Liu, Xiaobo

doi:10.1016/j.compositesb.2016.09.036

Cited by 38 publications

(23 citation statements)

References 29 publications

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“…Among them, A‐37 sample presented highest storage modulus, and changed from 4036 to 1433 MPa when heated from 40 to 500 °C. This might be attributed to the appropriate proportion of THAN to 3BOCN, and the presence of CN groups in THAN which promotes adhesion of low‐molecular‐weight homopolymers to phthalonitrile polymer in A‐37 sample . It is also noted that the modulus of the 55 mole ratio samples is lower than that of the 37 mole ratio samples in both systems, which may be attributed to the increase of homopolymerization products (oligomers) produced during the copolymerization reaction with an increase of the ratio of comonomer (THAN or THBN) in the system.…”

Section: Resultsmentioning

confidence: 96%

“…The average E α values of THAN/3BOCN‐37 and THBN/3BOCN‐37 blends were 94.74 ± 4.12 and 80.24 ± 4.29 kJ mol −1 , respectively. Obviously, the difference in average activation energy is mainly attributed to the presence of potential crosslinking sites (the pendant CN groups of THAN) with low reactivity in the THAN/3BOCN curing system . In addition, the trend in Fig.…”

Section: Resultsmentioning

confidence: 97%

“…Moreover, it is worth noting that the melting point of THAN/3BOCN‐55 is about 176 °C and its processing window is ca 120 °C, while the softening point of THBN/3BOCN‐55 is about 226 °C and its processing window is only ca 70 °C, suggesting that the introduction of mononitrile group successfully improves the processability of phthalonitrile resins. This phenomenon may be mainly attributed to the fact that the pendant CN group of THAN promotes the compatibility between the blend components via polar interaction . Thus, in the THAN/3BOCN‐55 blend, the other component may dissolve in 3BOCN melt, inducing a low melting point and wide processing window.…”

Section: Resultsmentioning

confidence: 99%

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Copolymerization modification: improving the processability and thermal properties of phthalonitrile resins with novel comonomers

Liu

Peng

et al. 2019

Polymer International

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Two novel tetrahydrophthalic anhydride end‐capped imide compounds (THAN and THBN) with high thermal stability were synthesized to promote the curing reaction of 1,3‐bis(3,4‐dicyanophenoxy)benzene (3BOCN), and to study the effects of comonomer structure on the curing behavior and thermal performance of phthalonitrile resins. The curing behaviors of THAN/3BOCN and THBN/3BOCN blends with various molar ratios were investigated using rheological analysis and differential scanning calorimetry, suggesting a wide processing window. Dynamic mechanical analysis and thermogravimetric analysis showed that the cured resins possessed high glass transition temperatures (> 500 °C), and superior thermal and long‐term thermo‐oxidative stabilities with weight retention of 95% ranging from about 544 to 558 °C in both nitrogen and air. All these results indicated that the processability and thermal properties of phthalonitrile resins could be improved further by modifying the structure of comonomer in this kind of curing system. © 2018 Society of Chemical Industry

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Section: Resultsmentioning

confidence: 96%

Section: Resultsmentioning

confidence: 97%

Section: Resultsmentioning

confidence: 99%

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Copolymerization modification: improving the processability and thermal properties of phthalonitrile resins with novel comonomers

Liu

Peng

et al. 2019

Polymer International

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“…9c and d, the cross-section of the cured PE28 comprises long fracture lines, while the cured PE19 exhibits a smooth and featureless fractured cross-section. This observation indicates that the epoxy resin could be toughened using PNBI 13,23 and this phenomenon may be correlated with the un-reacted nitrile groups.…”

Section: 2021mentioning

confidence: 83%

Novel benzimidazole-mediated phthalonitrile/epoxy binary blends system with synergistic curing behavior and outstanding thermal properties

Sun

et al. 2017

RSC Adv.

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Binary blends composed of benzimidazole-containing phthalonitrile (PNBI) and epoxy resin E51 were prepared. The PNBI/E51 (PE) blends showed good compatibilities and unique synergistic curing behaviors on full consumption of nitrile groups (PE19, PNBI:E51 ¼ 1 : 9 in weight ratio) and epoxy groups in the view of DSC, rheology and IR. Curing procedures of the PE blends were determined by DSC and DMA. Studies on the curing procedure showed that the PE blends exhibited good processability and could be fully cured at a temperature lower than 210 C. Studies on the cured PE blends showed that they have excellent thermal and mechanical properties. The glass transition temperatures (T g ) of cured PNBI/E51 blends were higher than 207 C (obtained by DMA). The 5% weight loss (T 5 ) and char yield at 800 C (CR) were higher than 360 C and 14% in nitrogen, respectively (obtained by TGA). Consequently, this study shows a novel modification in the method for the preparation of epoxy or phthalonitrile blend systems.

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“…Yang et al [67] prepared 1,3,5-tri-(3,4-dicyanophenoxy) benzene (TPh) through a reaction with the phloroglucinol and 4-nitro-phthalonitrile and then prepared the PEN/TPh composite materials which presented high dielectric permittivity, low loss tangent, and high heat resistance. Furthermore, the phthalocyanine rings can be formed by self-cross-linked through the -CN group in pendants or in the end of macromolecular chain of PEN [68], which can improve the dielectric properties and thermal stability of the composites. As shown in Figure 3, when PEN matrix was mixed with TPh, the dielectric permittivity of the obtained samples after cross-linking at high temperature is much higher than that of films without cross-linking.…”

Section: High-k Pen Compositesmentioning

confidence: 99%

Polyarylene Ether Nitrile-Based High-k Composites for Dielectric Applications

Zhan

Wang

et al. 2018

International Journal of Polymer Science

Self Cite

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Flexible polymer-based composites exhibiting high dielectric constant as well as low dielectric loss have been intensively investigated for their potential utilization in electronics and electricity industry and energy storage. Resulting from the polar -CN on the side chain, polyarylene ether nitrile (PEN) shows relatively high dielectric constant which has been extensively investigated as one of the hot spots as dielectric materials. However, the dielectric constant of PEN is still much lower than the ceramic dielectrics such as BaTiO 3 , TiO 2 , and Al 2 O 3 . In this review, recent and in-progress advancements in the designing and preparing strategies to obtain high-k PEN-based nanocomposites are summarized. According to the types of the added fillers, the effects of organic fillers, dielectric ceramic fillers, and conductive fillers on electric properties of PEN-based composites are investigated. In addition, other factors including the structures and sizes of the additive, the compatibility between the additive agent and the PEN, and the interface which affects the dielectric properties of the obtained composite materials are investigated. Finally, challenges facing in the design of more effective strategies for the high-k PEN-based dielectric materials are discussed.

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Studied on mechanical, thermal and dielectric properties of BPh/PEN-OH copolymer

Cited by 38 publications

References 29 publications

Copolymerization modification: improving the processability and thermal properties of phthalonitrile resins with novel comonomers

Copolymerization modification: improving the processability and thermal properties of phthalonitrile resins with novel comonomers

Novel benzimidazole-mediated phthalonitrile/epoxy binary blends system with synergistic curing behavior and outstanding thermal properties

Polyarylene Ether Nitrile-Based High-k Composites for Dielectric Applications

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