Structures and properties of polycarbonate-modified epoxies from two different blending processes

Don, Trong‐Ming; Yeh, Chao-Hsien; Bell, James P.

doi:10.1002/(sici)1097-4628(19991205)74:10<2510::aid-app20>3.0.co;2-p

Cited by 11 publications

(6 citation statements)

References 43 publications

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“…However, their brittle nature due to its high cross-link density and poor resistance to crack propagation limits the applications in advanced aerospace structures. To overcome this problem various Engineering thermoplastics like polyether sulfone [2,3], polycarbonate [4,5], polyethylene tere phthalate [6,7], poly ether ether ketone/hydroxyl terminated poly (ether ether ketone) with pendant methyl groups (PEEKMOH) [8,9], Poly ether ether ketone/hydroxyl terminated poly ether ether ketone with pendant tertiary butyl groups [10][11][12][13] or poly (cyanoarylene ether)/hydroxyl terminated poly arylene ether nitrile with pendant tertiary butyl groups [14,15] have been used as a toughness modifiers for epoxy resin without sacrificing other thermomechanical properties. However no evidence of improvement in modulus, gas barrier property and in coefficient of thermal expansion (CTE) was reported in the literature.…”

Section: Introductionmentioning

confidence: 99%

Thermoplastic toughened layered silicate epoxy ternary nanocomposites—Preparation, morphology, and thermomechanical properties

Asif

Rao

Saseendran

et al. 2009

Polymer Engineering & Sci

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Epoxy-clay ternary nanocomposites were processed by melt blending of hydroxyl terminated poly (ether ether ketone) oligomer with pendant methyl groups (PEEKMOH) with diglycidyl ether of bisphenol A (DGEBA) epoxy resin along with organically modified montmorillonite (OMC-OH) followed by curing with 4,4 0 -diamino diphenyl sulfone. Small angle X-ray diffraction and transmission electron microscopy revealed an intercalated morphology. Tensile, flexural, storage, and loss moduli were increased whereas the tensile, flexural, and impact strength and glass transition temperature were decreased with increase in clay content for the PEEKMOH toughened epoxy system. Fracture toughness and percentage strain were increased by 66% and 45% respectively whereas the coefficient of the thermal expansion was decreased by 27% with the incorporation of 1 phr OMC-OH to the PEEKMOH toughened epoxy system compared with neat epoxy. The scanning electron microscope pictures of fracture and tensile failed surfaces revealed crack path deflection and ductile fracture with the incorporation of OMC-OH confirming the improvement in toughness. The domain size and the distance between the domains of thermoplastic phase were decreased with the addition of nanoclay into the epoxy matrix indicating the restriction of the growth mechanism by nucleation during phase separation.

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Section: Introductionmentioning

confidence: 99%

Thermoplastic toughened layered silicate epoxy ternary nanocomposites—Preparation, morphology, and thermomechanical properties

Asif

Rao

Saseendran

et al. 2009

Polymer Engineering & Sci

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“…As an alternative, high performance engineering thermoplastics are used to toughen epoxy resins. Considerable amount of literature is available on the toughening of epoxy resins with engineering plastics like poly(ether sulfone) (PES),7, 8 polycarbonate,9, 10 poly(methyl methacrylate) (PMMA),11, 12 poly(butylene terephthalate) (PBT), poly(ethylene terephthalate) (PET),13, 14 and so forth. They are found to increase the fracture toughness without reducing the tensile strength and modulus along with retention of high temperature properties.…”

Section: Introductionmentioning

confidence: 99%

Diglycidyl ether of bisphenol‐A epoxy resin modified using poly(ether ether ketone) with pendent tert‐butyl groups

Francis

Thomas

Sadhana

et al. 2007

J Polym Sci B Polym Phys

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Bisphenol‐A‐based difunctional epoxy resin was modified with poly(ether ether ketone) with pendent tert‐butyl groups (PEEKT). PEEKT was synthesized by the nucleophilic substitution reaction of 4,4′‐difluoro benzophenone with tert‐butyl hydroquinone in N‐methyl‐2‐pyrrolidone. Blends with various amounts of PEEKT were prepared by melt‐mixing. All the blends were homogeneous in the uncured state. The glass transition temperature of the binary epoxy/PEEKT blends was predicted using several equations. Reaction‐induced phase separation was found to occur upon curing with a diamine 4,4′‐diaminodiphenyl sulfone. The phase morphology of the blends was studied using scanning electron microscopy. From the micrographs, it was found that PEEKT‐rich phase was dispersed in a continuous epoxy matrix. The domain size increased with the amount of PEEKT in the blends. The increase in domain size was due to the coalescence of the domains after phase separation. Dynamic mechanical analysis of the blends gave two peaks corresponding to epoxy‐rich phase and thermoplastic‐rich phase. The tensile strength and modulus of the blends remained close to that of the unmodified resin, while the flexural properties decreased with the addition of PEEKT to epoxy resin. The fracture toughness of the epoxy resin increased with the addition of PEEKT. Investigation of the fracture surfaces revealed evidences for local plastic deformation of the matrix, crack pinning, crack path deflection, and ductile tearing of PEEKT‐rich phase. Thermogravimetric analysis revealed that the initial decomposition temperature of the blends were close to that of the unmodified resin. Finally, the properties of the blends were compared with other modified PEEK/epoxy blends. © 2007 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 45: 2481–2496, 2007

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“…In this investigation we explore the possibility of enhancing the processing of PC using small amounts of an epoxy/diamine resin system, as a curable processing aid. Thus in the present study, the PC is the continuous phase, which contrasts with previous research [17,18,22] where small amounts of PC were added as a dispersed phase in an epoxy resin to toughen the cured thermoset matrix. In addition we also investigate the crystallisation of PC induced by the unreacted epoxy resin and its effect on the thermal-resistance of the final cured PC/epoxy resin blend.…”

Section: Introductionmentioning

confidence: 68%

Epoxy as a reactive plasticizer for improving polycarbonate processibility

Liang

Cook

Tcharkhtchi

et al. 2011

European Polymer Journal

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International audienceAn oligomer of a diepoxy (bisphenol-A diglycidyl ether, DGEBA) and an aromatic diamine (MCDEA) have been used as reactive plasticizers for polycarbonate (PC). A small amount of PC chain scission occurred during this blending process, probably due to transesterification of the PC carbonate group by the hydroxyl group of the DGEBA oligomer. Addition of DGEBA to PC was found to greatly reduce the Tg and processing temperature. Dynamic rheology measurements showed that the added epoxy can very effectively reduce the viscosity, but that the addition of epoxy also accelerated the crystallisation rate of the PC, which was confirmed by XRD, optical transmission microscopy and DMTA. The DMTA results of cured blends also showed that this crystallization of the PC enhanced their heat resistance properties. Sol-gel studies of the cured samples showed that some of the PC was grafted to the crosslinked epoxy network. Studies of the rubbery behaviour, solvent resistance of the cured blend and SEM images suggest that PC is the main continuous phase in the matrix and that the epoxy phase is mainly dispersed as sub-micron particles in the matrix

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Structures and properties of polycarbonate-modified epoxies from two different blending processes

Cited by 11 publications

References 43 publications

Thermoplastic toughened layered silicate epoxy ternary nanocomposites—Preparation, morphology, and thermomechanical properties

Thermoplastic toughened layered silicate epoxy ternary nanocomposites—Preparation, morphology, and thermomechanical properties

Diglycidyl ether of bisphenol‐A epoxy resin modified using poly(ether ether ketone) with pendent tert‐butyl groups

Epoxy as a reactive plasticizer for improving polycarbonate processibility

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