Abstract:Glasses can be used as core substrate for panel- and/or wafer-level packaging to achieve heterogeneous integration of chiplets and integrated passives in increasingly complex packages. Glass has a large number of advantages: The stiffness of glass (i) allows manufacturing of highly accurate buildup layers. These buildup layers can have manufacturing precision of 1μm and below on large dies with sizes of 50mm x 50mm and more, needed for antenna in package (AiP) applications and high performance computing (HPC).… Show more
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