Ta-incorporated HfO 2 with an enhanced thermal stability is grown using atomic layer deposition (ALD). 10 nm films with HfO 2 : Ta 2 O 5 ALD cycle ratios equal to 1:1 and 2:1 remain amorphous up to 900 and 750 C, respectively. The thermal stability of the 1:1 film is higher than both 10 nm HfO 2 and Ta 2 O 5 ; the dielectric constant of the 2:1 film is 21.5, higher than HfO 2 deposited at the same conditions. HfO 2 -HfTa x O y nanolaminates and periodic films composed of repeated [one ALD layer of Ta 2 O 5 þ x ALD layers of HfO 2 ] are grown to study the crystallization mechanism. When x > 4 periodic structures with Ta-free HfO 2 ultrathin layers exist in the periodic films. For both the nanolaminate and the periodic films, crystallization starts from the HfO 2 ultrathin layers, and the HfTa x O y layers block the growth of the crystalline phase. The thermal stability of these two kinds of non-homogeneous films is influenced by the Ta concentration in the HfTa x O y layers, thickness of the HfO 2 layers, and thickness of the HfTa x O y layers, with different degrees of importance.