2010
DOI: 10.1016/j.jphotochem.2010.06.030
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Structure–reactivity relations for DC-magnetron sputtered Cu-layers during E. coli inactivation in the dark and under light

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Cited by 43 publications
(31 citation statements)
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“…Thus, coatings presenting an improved stability and a suitable amount of Cu may represent an improvement to the present state of the art (O'Gorman and Humphreys 2012). Recently developed uniform, adhesive Cu-nanoparticle films obtained by direct current magnetron sputtering (DCMS) appear to satisfy these requirements (Castro et al 2010). Moreover, we have recently shown that Cu nanoparticles sputtered on flexible surfaces possess rapid bactericidal activity against a number of MRSA isolates (Rio et al 2012).…”
Section: Introductionmentioning
confidence: 99%
“…Thus, coatings presenting an improved stability and a suitable amount of Cu may represent an improvement to the present state of the art (O'Gorman and Humphreys 2012). Recently developed uniform, adhesive Cu-nanoparticle films obtained by direct current magnetron sputtering (DCMS) appear to satisfy these requirements (Castro et al 2010). Moreover, we have recently shown that Cu nanoparticles sputtered on flexible surfaces possess rapid bactericidal activity against a number of MRSA isolates (Rio et al 2012).…”
Section: Introductionmentioning
confidence: 99%
“…Figure 7(a), trace 4, shows that the redox potential Cu-nanoparticles induce bacterial inactivation within reasonable times. 7,10,16 Finally, Fig. 7(a), trace 5, shows no bacterial inactivation on the polyester surface under actinic light.…”
Section: -4 Rtimimentioning
confidence: 87%
“…The vacuum in the chamber was of 0.1 Pa, and the distance between the Cu-target and the polyester was $10 cm. [16][17][18] The nominal film thickness was determined with a profilometer (Alphastep500, TENCOR) on silica wafers. Figure 1 shows C and the thickness of the polyester was 6130 lm 610%.…”
Section: Methodsmentioning
confidence: 99%
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“…DCP was used to sputter Ag and was operated at 50 kHz with 15% reversed voltage. The sputtering current was fixed at 280 mA (14.3 mA/cm 2 ) providing a negative voltage of −500 V, 75 V as reverse voltage (15% of 500 V) and a power of 140 W. Details regarding sputtering Ag on different textiles using the unit available in our laboratory have been described recently [6,10,11,23,24].…”
Section: Sputtering Of Tin Underlayers and Tin-ag Films Thickness Camentioning
confidence: 99%