Structure–property relationship of new polyimide–organically modified silicate–phosphotungstic acid hybrid material system

Comparison of hybrid polyimide films with silica and organosilica obtained via sol–gel process

“…In addition, the dipole of the remaining silanol groups in the hybrid materials could have trapped the electrons injected from the electrodes during electrical characterization, thus forming a negatively charged product (SiO À ), as occurs in Poole-Frenkel conduction. 31 Notably, the PI-S system exhibited a higher dielectric constant than the PI-OS system at the same silica content (Figure 11(c)). Such a phenomenon is due to the formation of poor interfaces between the SiO 2 spheres and PI.…”

Qualitative and Semiquantitative Determination of the Atomic and Molecular Tungsten Distributions in Hybrid Hydroxyurethanes–Poly(dimethylsiloxane) Films Containing Phosphotungstates ([PW12O40]3–)

“…26 Our research group earlier published the SR-μXRF mapping of phosphotungstates ([PW 12 O 40 ] 3− ) in the characterization of hybrid nanomaterials. 27,28…”

“…26 Our research group earlier published the SR-mXRF mapping of phosphotungstates ([PW 12 O 40 ] 3À ) in the characterization of hybrid nanomaterials. 27,28 In grazing angle X-ray fluorescence (GIXRF), the X-ray incident beam is almost parallel to surface of the sample at angles equal or slightly larger (two to three times) than the value of the critical angle of sample's support. GIXRF method is applied in the analysis of thin films, in order to obtain composition, density, and thickness.…”

Synthesis and properties of benzocyclobutene-terminated imide-containing cyano group

“…Polyimides (PIs) are well-known as high-performance polymers, and they have been widely applied in the fields of microelectronics, membranes, composites, and optoelectronics because of their outstanding mechanical, thermal, and electrical properties. [26][27][28][29][30][31][32][33][34] However, most PIs exhibit poor processability including low solubility and nonmelting characteristics due to their rigid structures and strong intermolecular force. 35 Generally, PI processing was carried out through the thermal imidization of poly(amic acid) at 150-350 C. This process is accompanied by the release of water vapor and thus causes microvoids on the films.…”