Structure oriented compact model for advanced trench IGBTs without fitting parameters for extreme condition: Part II

Takaishi, Junpei; Harada, S.; Tsukuda, Mamoru; Omura, Ichiro

doi:10.1016/j.microrel.2014.07.158

Cited by 9 publications

(2 citation statements)

References 15 publications

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“…In order to minimise the probability of sudden IGBT failure, precise real-time monitoring of junction's temperature is crucial to evaluating the overall operational life and hence, reliability of PECs. Some of previous research, which looked into obtaining applicable electrothermal models for IGBTs such as Takaishi et al (2014) who presented the trade-off curve between turn-off loss and saturation collector voltage under extremely high current conduction conditions. In theory, the electro-thermal response of IGBTs critically depends on the collector tail current and collector-emitter saturation voltage.…”

Section: A Power Electronics In Wind Turbinesmentioning

confidence: 99%

Smart Sensing System for Enhanceing the Reliability of Power Electronic Devices Used in Wind Turbines

Teay¹,

Batunlu

Albarbar³

2017

International Journal on Smart Sensing and Intelligent Systems

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Section: A Power Electronics In Wind Turbinesmentioning

confidence: 99%

Smart Sensing System for Enhanceing the Reliability of Power Electronic Devices Used in Wind Turbines

Teay¹,

Batunlu

Albarbar³

2017

International Journal on Smart Sensing and Intelligent Systems

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“…In literature, Chibante et al studied physics based models for NPT [2] and PT IGBTs [3] for hole/electron distribution based on ambipolar diffusion equation. Takaishi et al [4] studied analytical formulation turn-off waveform for advanced trench gate IGBTs for calculating tradeoff curve between turn-off loss and saturation voltage. Ronsisvalle et al [5] proposed an experimental characterization for the input capacitance of FS Trench IGBTs.…”

Section: Introductionmentioning

confidence: 99%

Real-time system for monitoring the electro-thermal behaviour of power electronic devices used in boost converters

Batunlu

Albarbar

2016

Microelectronics Reliability

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Reliability of power electronic devices (PEDs) is a key issue to secure power supplies in modern word, especially, those generated from renewable energy sources. Thermal stress due to switching frequency and environmental conditions are commonest cause of currently unsatisfactory PEDs reliability scores. In this paper, the electro thermal performance of PEDs and related parameters are critically investigated using three types of differently manufactured insulated gate bipolar transistors (IGBTs). Namely, punch through (PT), non-punch through (NPT) and field stop (FS) silicon trench gate technologies. First, currents and voltages of the examined IGBTs were measured under different operating temperatures, switching frequencies and electrical loading conditions. Second, power losses of the examined devices were calculated, in real time, based on their measured currents and voltages using realistic mathematical model embedded in a dSPACE system. Subsequently, the power losses for each device were used as an input to a finite element model to graphically predict heat distributions for each of the monitored devices. Compared to expensive measurements taken by high-resolution thermal imaging cameras, the accuracy of the developed system achieved 97%. The obtained results demonstrate the developed model would serve as an inexpensive and powerful tool for monitoring PEDs thermal conditions.

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Thermal Analysis of Power Electronics: Review

Albarbar

Batunlu

2017

Thermal Analysis of Power Electronic Devices Used in Renewable Energy Systems

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Structure oriented compact model for advanced trench IGBTs without fitting parameters for extreme condition: Part II

Cited by 9 publications

References 15 publications

Smart Sensing System for Enhanceing the Reliability of Power Electronic Devices Used in Wind Turbines

Smart Sensing System for Enhanceing the Reliability of Power Electronic Devices Used in Wind Turbines

Real-time system for monitoring the electro-thermal behaviour of power electronic devices used in boost converters

Thermal Analysis of Power Electronics: Review

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