1999
DOI: 10.1002/(sici)1099-0488(19990815)37:16<2137::aid-polb16>3.0.co;2-i
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Structure and property relationships in model diglycidyl ether of bisphenol-a and diglycidyl ether of tetramethyl bisphenol-a epoxy systems. I. Mechanical property characterizations

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Cited by 20 publications
(31 citation statements)
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“…The modification is usually achieved by two means, including chemical modification of epoxy resin from a rigid backbone structure to a more flexible backbone structure and decrease of the crosslink density of a cured epoxy resin 12, 13. For example, flexible siloxane segments are incorporated into diglycidyl ether of bisphenol‐A (DGEBA) and greatly improve its impact strength;14 Takao Iijima has synthesized some new aromatic epoxy resins, which are incorporated with oxyethylene units and finds that the new resins are more tough and show no decrease in strength and modulus compared to the unmodified resins;15, 16 Sue uses DGEBA coupled with bisphenol‐A (BPA) as a chain extender to investigate the effect of crosslink density on the toughness and modulus 17, 18. In these studies, the modification of epoxy structure not only improves the toughness but also improves the processability of the epoxy resins 19, 20…”
Section: Introductionmentioning
confidence: 99%
“…The modification is usually achieved by two means, including chemical modification of epoxy resin from a rigid backbone structure to a more flexible backbone structure and decrease of the crosslink density of a cured epoxy resin 12, 13. For example, flexible siloxane segments are incorporated into diglycidyl ether of bisphenol‐A (DGEBA) and greatly improve its impact strength;14 Takao Iijima has synthesized some new aromatic epoxy resins, which are incorporated with oxyethylene units and finds that the new resins are more tough and show no decrease in strength and modulus compared to the unmodified resins;15, 16 Sue uses DGEBA coupled with bisphenol‐A (BPA) as a chain extender to investigate the effect of crosslink density on the toughness and modulus 17, 18. In these studies, the modification of epoxy structure not only improves the toughness but also improves the processability of the epoxy resins 19, 20…”
Section: Introductionmentioning
confidence: 99%
“…[12,13] Fourier transform infrared spectra (Nicolet Magna 550, Nicolet Inc., Madison, WI) in the near infrared (NIR) region were collected with 264 scans at 4 cm −1 resolution to measure bulk polymer cure (C=CH 2 peak at 6164 cm −1 ) [14] using an area baseline technique with peak areas being normalized to the polymer thickness. The degree of conversion (DC) at 15 min or 24 h after curing was determined with respect to the uncured resin composite using the following equation: (5) where A 0 is the peak area of the uncured composite, A t is the peak area of the composite at 15 min or 24 h. Data was statistically analyzed by two-way analysis of variance (ANOVA) and an all pairwise multiple comparison procedure (Holm-Sidak, p < 0.05).…”
Section: Methodsmentioning
confidence: 99%
“…Dimethacrylates with aromatic core structures have been reported to produce rigid polymers, while dimethacrylates with aliphatic structures produce flexible polymers [2,3] . It has also been suggested that dimethacrylates with "hard" segments (aromatic groups) and "soft" segments (aliphatic groups) will result in polymers with increased toughness and improved wear resistance in dental composites [4,5]. For example the widely used dental monomer Bis-GMA (reaction product(s) of the diglycidyl ether of bisphenol A and methacrylic acid, primarily 2,2-bis[4-(2-hydroxy-3-methacryloxyprop-1-oxy)phenyl]propane) contains bulky aromatic groups that make it a rigid molecule and is commonly mixed with the flexible monomer TEGDMA (triethyleneglycol dimethacrylate).…”
Section: Introductionmentioning
confidence: 99%
“…Second, the dissolved CTPB particles result in a decrease in the content of the rigid segment structure of the thermosetting network, thereby reducing the T g . Finally, the dispersed CTPB particles reduce the cross-linking density and the content of rigid segment structure of the thermosetting network, 28 resulting in improved compatibility and enhancement of the CTPB-matrix interaction. The first effect plays a major role at low CTPB content, so the T g has a noticeable decrease.…”
Section: Dynamic Mechanical Analysis (Dma)mentioning
confidence: 99%