Structure and mechanical properties of co-deposited TiAl thin films

Hampshire, J.; Kelly, Peter; Teer, D. G.

doi:10.1016/s0040-6090(02)00851-9

Cited by 17 publications

(9 citation statements)

References 9 publications

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“…2. Further details concerning production of these coatings can be found elsewhere [7][8][9][10][11].…”

Section: Methodsmentioning

confidence: 99%

“…The closed field unbalanced magnetron sputter ion plating system (CFUBMSIP) for the deposition of high-quality coatings has been shown to be very effective [6][7][8][9][10][11][12]. The technique mainly reduces the loss of electron from the discharge to the chamber walls, therefore increasing the resulting ionization in the discharge and the ion current density at a biased substrate [13,14].…”

Section: Introductionmentioning

confidence: 99%

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Surface free energy of non-stick coatings deposited using closed field unbalanced magnetron sputter ion plating

Sun

Lee

Dai

et al. 2007

Applied Surface Science

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“…2. Further details concerning production of these coatings can be found elsewhere [7][8][9][10][11].…”

Section: Methodsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Surface free energy of non-stick coatings deposited using closed field unbalanced magnetron sputter ion plating

Sun

Lee

Dai

et al. 2007

Applied Surface Science

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“…to produce Ti-Al coatings have been developed in the last decade: thin-film deposition [40,41], ion implantation [42], and laser melting deposition [43]. In [14,15], the pulsed liquid-phase mixing of Ti substrate with predeposited Al film was firstly used to fabricate Ti 3 Al/TiAl-based surface alloys.…”

Section: Synthesis and Characterization Of Timentioning

confidence: 99%

Surface Modification and Alloying of Aluminum and Titanium Alloys with Low-Energy, High-Current Electron Beams

Ротштейн

Шулов

2011

Journal of Metallurgy

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The paper reviews the results of investigations of surface modification and alloying of Al, Ti, and its alloys with a low-energy (up to ∼40 keV), high-current (up to 25 J/cm 2 ) electron beams of microsecond duration under systematically varied conditions. The microstructural evolution of the surface layers of Al alloys (Al2024 and Al6061) and Ti-6Al-4V alloy subjected to pulsed melting as well as changes in surface-sensitive properties of these alloys are considered. Phase formation and properties of Albased and Ti-based surface alloys, synthesized by liquid-phase mixing of multilayer film-substrate systems in wide range of solid solubility, including [Al/Si]/Al, [Al/C]/Al, [Zr/Ti]/Ti-6Al-4V, and Al/Ti, are studied. In case of Ti-based substrates, this method allows to fabricate the single-phase nanocrystalline α-(TiZr) surface alloy, free of Al and V, as well as nanosized and ultrafine grain TiAl/Ti 3 Al-based surface alloys of thickness ≥3 μm with enhanced mechanical properties.

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“…Hampshire et al [16] also reported that at 600 C Ti/Al multilayer thin films with periods between 3 and 25 nm transformed into a g-TiAl single-phase structure. For higher periods, Michaelsen et al [17] observed a TiAl 3 intermediate phase, formed at 450 C, with the subsequent formation of g-TiAl after heating at 700 C, indicating that the multilayer with a 50 nm period had also fully reacted.…”

Section: Interlayer Thin Filmsmentioning

confidence: 95%

Nanometric multilayers: A new approach for joining TiAl

et al. 2006

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A novel intermetallic alloy diffusion bonding procedure is being developed. The innovative aspect relies on the use of sputtered nanometallic multilayers made up of the elements present in the bulk intermetallics to enhance the bonding mechanisms. For this purpose a deep knowledge of the multilayer thin films is required, focusing on thermal phase stability and grain size evolution. g-TiAl was selected for this study and Ti/Al multilayer thin films with nanometric period (L ¼ 4 nm) were deposited onto Tie(45e49)Ale(3e2)Nbe2Cr (at.%) substrates by d.c. magnetron sputtering. The as-deposited titanium and aluminium nanolayers with crystallite sizes of 5e50 nm evolve toward the equilibrium g-TiAl structure after heat treatment for at least up to 600 C at a 10 C min ÿ1 heating rate. Whatever the heating temperature and holding time, between 600 and 1000 C, the g-TiAl phase is stable. During the thermal cycle the growth of the nanometric grains is promoted, this effect being more pronounced as the temperature and holding time increase. Consequently, the hardness decreases from 11.9 GPa (600 C, 1 h) to 6.5 GPa (1000 C, 3 h). This study allowed the thermal treatment required to join g-TiAl parts to be established.

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Structure and mechanical properties of co-deposited TiAl thin films

Cited by 17 publications

References 9 publications

Surface free energy of non-stick coatings deposited using closed field unbalanced magnetron sputter ion plating

Surface free energy of non-stick coatings deposited using closed field unbalanced magnetron sputter ion plating

Surface Modification and Alloying of Aluminum and Titanium Alloys with Low-Energy, High-Current Electron Beams

Nanometric multilayers: A new approach for joining TiAl

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