2013
DOI: 10.1016/j.surfcoat.2012.07.063
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Structure and corrosion resistance of Ti/TiC coatings fabricated by plasma immersion ion implantation and deposition on nickel–titanium

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Cited by 35 publications
(18 citation statements)
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“…TiC is already used in a wide variety of applications, such us wearresistant coatings [5], passive films [6], high power electronic devices [7], and many others. For applications envisaging low electrical conductivity, as needed in high power electronics, ohmic contacts made by TiC hetero-epitaxial films proved to be a valuable solution [8,10].…”
Section: Introductionmentioning
confidence: 99%
“…TiC is already used in a wide variety of applications, such us wearresistant coatings [5], passive films [6], high power electronic devices [7], and many others. For applications envisaging low electrical conductivity, as needed in high power electronics, ohmic contacts made by TiC hetero-epitaxial films proved to be a valuable solution [8,10].…”
Section: Introductionmentioning
confidence: 99%
“…Nanocomposite coatings consisted of nanocrystalline grains and amorphous matrix promises possibility of synthesizing a surface protection layer with an unusual combination of mechanical properties [16]. Titanium carbide (TiC) may be a potential candidate for such a surface protection coating which serves as barrier layer because of its high mechanical hardness, excellent corrosion resistance and good biocompatibility [17][18][19]. The corrosion behaviour can be studied by potentiodynamic measurements and by Electrochemical Impedance Spectroscopy (EIS).…”
mentioning
confidence: 99%
“…The EIS spectra of the untreated Ti and NiTi have a single time constant, R S (CPE P R P ) because at the metal surface and electrolyte (154 mM NaCl solution) interface, the resistance to electron transfer during the faradic process (charge transfer resistance) in parallel with the double layer capacitance. A single time constant was observed from Ti and NiTi in 154 mM NaCl by Jamesh et al [34], Li et al [52], and Shanaghi et al [69]. In this equivalent circuit, R S (CPE OL R OL )(CPE IL R IL )(CPE P R P ) (G1 in Fig.…”
Section: Discussionmentioning
confidence: 84%