Structural reliability simulation for the latching mechanism in MEMS-based Safety and Arming device

Tu, Hongmao; Lou, Wenzhong; Sun, ZhengMing; Qian, Yunpeng

doi:10.1016/j.advengsoft.2017.02.008

Cited by 14 publications

(11 citation statements)

References 14 publications

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“…Lee and Yeonsu [90] proposed a latching inertial switch with a threshold of about 44 g in 2016. In 2018, H Tu et al [91] used FORM (First Order Second Moment Method) to measure the working reliability relative to the variability of size parameters. In 2019, H Feng et al [75] reported a latching inertial switch for arming devices.…”

Section: Latch Mechanismsmentioning

confidence: 99%

Reliability of MEMS in Shock Environments: 2000–2020

Peng

You

2021

Micromachines

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The reliability of MEMS in shock environments is a complex area which involves structural dynamics, fracture mechanics, and system reliability theory etc. With growth in the use of MEMS in automotive, IoT, aerospace and other harsh environments, there is a need for an in-depth understanding of the reliability of MEMS in shock environments. Despite the contributions of many articles that have overviewed the reliability of MEMS panoramically, a review paper that specifically focuses on the reliability research of MEMS in shock environments is, to date, absent. This paper reviews studies which examine the reliability of MEMS in shock environments from 2000 to 2020 in six sub-areas, which are: (i) response model of microstructure, (ii) shock experimental progresses, (iii) shock resistant microstructures, (iv) reliability quantification models of microstructure, (v) electronics-system-level reliability, and (vi) the coupling phenomenon of shock with other factors. This paper fills the gap around overviews of MEMS reliability in shock environments. Through the framework of these six sub-areas, we propose some directions potentially worthy of attention for future research.

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Section: Latch Mechanismsmentioning

confidence: 99%

Reliability of MEMS in Shock Environments: 2000–2020

Peng

You

2021

Micromachines

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“…Pradeep et al studied the reliability of MEMS accelerometer in mechanical shocks by modeling simulations [12]. Tu et al adopted Kriging approximation and probabilistic algorithms method with finite element simulations to study the effect of input uncertainties on the response of the MEMS structure [13]. Khanna et al found that MEMS failure takes place between the deposited layers and this failure may occur both because of processing defects or high interfacial stress levels [14], such as a large stress gradient and mechanical shocks.…”

Section: Introductionmentioning

confidence: 99%

Investigation of Acoustic Injection on the MPU6050 Accelerometer

Zhang

Shen

et al. 2019

Sensors

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Acoustic injection is one of the most dangerous ways of causing micro-electro–mechanical systems (MEMS) failures. In this paper, the failure mechanism of acoustic injection on the microprocessor unit 6050 (MPU6050) accelerometer is investigated by both experiment and simulation. A testing system was built to analyze the performance of the MPU6050 accelerometer under acoustic injection. A MEMS disassembly method was adopted and a MATLAB program was developed to establish the geometric model of MPU6050. Subsequently, a finite element model of MPU6050 was established. Then, the acoustic impacts on the sensor layer of MPU6050 were studied by acoustic–solid coupling simulations. The effects of sound frequencies, pressures and directions were analyzed. Simulation results are well agreed with the experiments which indicate that MPU6050 is most likely to fail under the sounds of 11,566 Hz. The failure mechanism of MPU6050 under acoustic injection is the relative shift of the capacitor flats caused by acoustic–solid resonance that make the sensor detect false signal and output error data. The stress is focused on the center linkage. MPU6050 can be reliable when the sound pressure is lower than 100 dB.

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“…Micro-electromechanical-system (MEMS) technology has been explored in this field recently. According to the different fabrication methods, the MEMS S&A device can be divided into two categories—a metal-based device [3,4,5,6,7,8] and a silicon-based device [9,10,11,12]. Ni is commonly used in the metal-based device.…”

Section: Introductionmentioning

confidence: 99%

The Hybrid Fabrication Process of Metal/Silicon Composite Structure for MEMS S&A Device

Fang

Zhang

et al. 2019

Micromachines

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The micro-electromechanical system (MEMS) safety-and-arming (S&A) device has the features of integration and miniaturization, which is one of the important directions of weapon development. Confined by the fabrication process, the silicon-based devices are too fragile, and the metal-based devices are low precision. In order to solve the contradiction between high precision and high structure strength, a metal/silicon composite structure is proposed in this paper, and a hybrid fabrication process is introduced. This new method mainly consists of metal sputtering, electroplating, and (inductively–coupled-plasma) ICP etching. As the resolution of the thick dry film is limited, the process of a femtosecond laser is applied to refine the structure, and the Ni plate (a block of 1 mm × 3 mm × 0.3 mm with a cavity of ϕ 0.85 mm × 0.3 mm in the center) is fabricated on the silicon-on-insulator (SOI) wafer successfully. After the double sides are etched by ICP, the SOI wafer is immersed in a buffered-oxide-etch (BOE) etchant to remove the buried layer. The cover plate acts as the encapsulation and is bonded with the SOI wafer by the epoxy glue. Then, the temporary support beam of the device is broken by the probe, and the suspended composite structure can be fully released. The hybrid process is the integration of the silicon-based process and the metal-based process, which can combine the advantages of both high precision and a high structure strength. The process proposed here is suitable for the application of weapon miniaturization.

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Structural reliability simulation for the latching mechanism in MEMS-based Safety and Arming device

Cited by 14 publications

References 14 publications

Reliability of MEMS in Shock Environments: 2000–2020

Reliability of MEMS in Shock Environments: 2000–2020

Investigation of Acoustic Injection on the MPU6050 Accelerometer

The Hybrid Fabrication Process of Metal/Silicon Composite Structure for MEMS S&A Device

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