Structural Reliability of Novel 3-D Integrated Thermal Packaging for Power Electronics

Abstract

Thermal management has become increasingly important to ensuring the reliability of power electronics components due to the continuing increase of device power and integration levels. New approaches to provide the necessary thermal management include the development of embedded two-phase cooling systems. However, the reliability of such devices and that of their integration into the power electronics package have yet to be studied. This thesis details a Physics of Failure (PoF) based structural reliability analysis of novel 3-D integrated thermal packaging for next generation Power Electronics. The cooling technology aims to combine two-phase embedded manifold microchannel cooling in thin film evaporation mode with thermoelectric hot-spot cooling using a high conductivity Mini-contact. This study will focus on thermo-mechanical stress analysis of three different Mini-contact structures, micro-fin structure and reliability prediction of solder joint at various levels in Power Electronics package based on Engelmaier's failure model for SAC 305.