2016
DOI: 10.1016/j.cryogenics.2016.02.002
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Structural modeling of HTS tapes and cables

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Cited by 61 publications
(18 citation statements)
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“…Given the strain dependence of I c , the presented approach allows to determine the expected I c of the REBCO tape after bending [45][46][47][48]. Considering the I c dependence on both strain and magnetic field, one can determine the expected cable and magnet performance in order to assess if the fabrication process has introduced any conductor degradation [49].…”
Section: Discussionmentioning
confidence: 99%
“…Given the strain dependence of I c , the presented approach allows to determine the expected I c of the REBCO tape after bending [45][46][47][48]. Considering the I c dependence on both strain and magnetic field, one can determine the expected cable and magnet performance in order to assess if the fabrication process has introduced any conductor degradation [49].…”
Section: Discussionmentioning
confidence: 99%
“…The tape was modeled using SOLSH190, an 8-node solid shell element which prescribes the tape to be a uniform volume with specified material properties of each individual layer [15]. A thin layer of solder was modelled between the tape and the U-spring, and bonded contact conditions were used.…”
Section: B Residual Thermal Strain In the Rebco Layer: Fea Studymentioning
confidence: 99%
“…For the Uspring, thermal material proprieties of pure copper were assigned. Mechanical and thermal properties of the materials can be found in [15]- [17]. Based on the FEA results, a residual thermal strain of -0.05% was estimated for the REBCO layer prior to testing at 77 K (Fig.…”
Section: B Residual Thermal Strain In the Rebco Layer: Fea Studymentioning
confidence: 99%
“…HTS tapes were modeled as a uniform volume using SOLSH190 structural solid-shell elements using a novel technique developed in [8]. Each tape was modelled with a uniform thickness along the width, neglecting the thickness variation in the copper layers typically observed in real tapes.…”
Section: Element Type and Mesh Densitymentioning
confidence: 99%
“…Each tape was modelled with a uniform thickness along the width, neglecting the thickness variation in the copper layers typically observed in real tapes. Details of the modeling of the multi-layer tape as uniform volume are listed in [8]- [9]. The support structure was meshed using SOLID185 homogeneous structural solid elements.…”
Section: Element Type and Mesh Densitymentioning
confidence: 99%