1990
DOI: 10.1016/0013-4686(90)80038-p
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Structural investigation of the initial stages of copper electrodeposition on polycrystalline and single crystal palladium electrodes

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Cited by 33 publications
(14 citation statements)
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“…Cu UPD on noble metals is a relatively slow process and the electrochemical spectra of the interfaces are strongly dependent on the potentiodynamic perturbation used in the experiments, specially on Pd surfaces because of the less noble characteristics of this metal (19). On the other hand, the deposition of small amounts of Cu on Pt enhances the adsorption of halides present in solution, as it was confirmed by in-situ surface EXAFS and X-ray standing wave spectroscopy (23)(24)(25)(26).…”
Section: Introductionmentioning
confidence: 63%
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“…Cu UPD on noble metals is a relatively slow process and the electrochemical spectra of the interfaces are strongly dependent on the potentiodynamic perturbation used in the experiments, specially on Pd surfaces because of the less noble characteristics of this metal (19). On the other hand, the deposition of small amounts of Cu on Pt enhances the adsorption of halides present in solution, as it was confirmed by in-situ surface EXAFS and X-ray standing wave spectroscopy (23)(24)(25)(26).…”
Section: Introductionmentioning
confidence: 63%
“…However, the evaluation of the real surface electrode area was accomplished by voltammetric profiles only up to 1.27 V vs NHE where a full PdO monolayer is formed (27). An electropolishing procedure was also assayed in a nonaqueous bath, as it has been previously suggested by Chierche et al (19). However, this preparation procedure leads to the development of defined crystallographic planes on the pc surface after a number of trials, characterized by single voltammetric peaks.…”
Section: Methodsmentioning
confidence: 99%
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