Structural influence of nitrogen-containing groups on triphenylmethane-based levelers in super-conformal copper electroplating

Li, Zhen; Tan, Baizhao; Luo, Jiye; Qin, Jinfeng; Yang, Guannan; Cui, Chengqiang; Li, Pan

doi:10.1016/j.electacta.2021.139445

Cited by 27 publications

(10 citation statements)

References 42 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Meanwhile, a pattern reaction for the synthesis of levelers has not yet emerged. Design and synthesis of levelers are time-consuming, so the study of the structure–property of levelers is of great significance. ,, A previous study reported diketopyrrolopyrrole (DPP)-based levelers which have a fully conjugated, highly stable, and rigid planar structure . A DPP-based leveler with a four-ring-fused skeleton is an excellent substrate that could firmly anchor on the copper surface and optimize the deposition behavior.…”

Section: Introductionmentioning

confidence: 99%

“…8,9 Levelers are usually considered to be the most important additive due to the fact that they can selectively adsorb on the high current density area of the cathode surface (the mouth of the TH), while the low current density region (the center of the TH) is less affected. 8,10,11 As is well known, levelers in copper deposition are typically nitrogen-containing quaternary ammonium salts, quaternary ammonium surfactants, polymers, and inorganic anions. 12−14 Recently, our team have developed plenty of pigment-based quaternary ammonium salts, while theoretical calculations were used to evaluate these levelers, and launched chemical calculations that showed distinct leveling performance for uniform copper electrodeposition.…”

Section: Introductionmentioning

confidence: 99%

“…15−17 property of levelers is of great significance. 10,18,19 A previous study reported diketopyrrolopyrrole (DPP)-based levelers which have a fully conjugated, highly stable, and rigid planar structure. 15 A DPP-based leveler with a four-ring-fused skeleton is an excellent substrate that could firmly anchor on the copper surface and optimize the deposition behavior.…”

Section: Introductionmentioning

confidence: 99%

“…Multilayer PCBs with high-density interconnect are one of the key components in the manufacture of these electronic products. , Through-holes (THs) are usually used to realize the interconnection between layers on the PCB board. − To achieve a uniform and qualified copper coating, the addition of multiple additives is necessary. Brighteners (e.g., bis[3-sulfopropyl] disulfide, SPS), inhibitors (e.g., poly[ethylene glycol], PEG), and levelers (e.g., Janus Green B) are categorized according to their distinctive electrochemical properties, but all of them play a key role in copper electrodeposition. , Levelers are usually considered to be the most important additive due to the fact that they can selectively adsorb on the high current density area of the cathode surface (the mouth of the TH), while the low current density region (the center of the TH) is less affected. ,, …”

Section: Introductionmentioning

confidence: 99%

See 3 more Smart Citations

Strong Convection-Dependent Adsorption of Phenothiazine Skeleton Levelers and Their Application in Copper Electroplating

et al. 2023

View full text Add to dashboard Cite

The design and synthesis of high-performance levelers remain a major challenge to date. Herein, a series of phenothiazine (PTZ) derivatives were designed and synthesized, and they had a butterfly conformation, and their adsorption capacities were easier to modulate. To check out the inhibition capabilities among these eight PTZ derivatives, electrochemical measurements and theoretical calculations were carried out, and PTZ-8 indicated the strongest inhibition capabilities among these PTZ derivatives. Besides, galvanostatic measurements were also carried out to evaluate the overall performance of the levelers. The results showed that PTZ-8 had a potential oscillation, but PTZ-6 had strong convection-dependent adsorption. Due to the potential oscillation of PTZ-8, PTZ-6 as the representative leveler was selected for through-hole electrodeposition. In addition, field-emission scanning electron microscope images and X-ray diffraction results displayed the surface morphology, which indicated that the addition of PTZ-6 could lead to a fine copper deposit and cause the preferential orientations of copper deposits to change from [220] to [111]. This study might lay the foundation for the design of high-performance levelers.

show abstract

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Strong Convection-Dependent Adsorption of Phenothiazine Skeleton Levelers and Their Application in Copper Electroplating

et al. 2023

View full text Add to dashboard Cite

show abstract

“…15 suppressor, poly(ethylene glycol) (PEG) can not only increase cathodic polarization and suppress copper deposition but also reduce surface tension and improve wettability. 16 As for levelers, although several levelers have been proposed and developed, their performance cannot well meet the needs of copper superfilling. Therefore, it is highly necessary to develop new levelers.…”

Section: Introductionmentioning

confidence: 99%

Experimental and Theoretical Study of the New Leveler Basic Blue 1 during Copper Superconformal Growth

Li,

et al. 2023

ACS Appl. Mater. Interfaces

View full text Add to dashboard Cite

A novel chlorinated functional group-modified triphenylmethane derivative leveler BB1 is used to achieve superconformal electrodeposition in microvias. Cyclic voltammetry (CV) and electrochemical impedance spectroscopy (EIS) are performed to study the suppressing effect of BB1, while the convection-dependent adsorption of BB1 on the copper surface is analyzed by galvanostatic measurement, and a BB1 concentration window between 100 and 200 mg/L is beneficial for superfilling. The interactions among BB1, bis-(sodium sulfopropyl) disulfide (SPS), and poly(ethylene glycol) (PEG) are also investigated. Density functional theory (DFT) calculation and in situ Raman spectroscopy are coupled to study the suppression mechanism and synergistic suppression mechanism, namely, the adsorption effect between BB1 and copper substrate, as well as the coordination effect between the modified chlorinated functional group and Cu 2+ , is proposed. The copper layer becomes smoother and more compact with an increase in BB1 concentration, according to scanning electron microscopy (SEM) and atomic force microscopy (AFM), while X-ray diffraction (XRD) analysis shows that the introduction of BB1 is conducive to the formation of the copper (220) plane. Besides, the solution wettability is boosted by BB1. A copper interconnecting layer with high quality is achieved with 150 mg/L BB1, while the surface deposition thickness (SDT) is about 34 μm and filling percentages (FPs) for microvias with diameters of 100, 125, and 150 μm are 81. 34, 82.72, and 81.39%, respectively.

show abstract

Improving the Performance of Aqueous Zinc‐ion Batteries by Inhibiting Zinc Dendrite Growth: Recent Progress

Lim

Kim

et al. 2022

Chemistry An Asian Journal

View full text Add to dashboard Cite

Aqueous zinc-ion batteries (ZIBs) are promising candidates for the next-generation high-energy storage devices, owing to their resource availability, low cost, ecofriendliness, and high safety. The zinc (Zn) metal anode in a suitable battery system, including an electrolyte and a highperformance cathode electrode, can deliver an excellent electrochemical performance. However, several obstacles must be overcome to utilize aqueous ZIBs. Among these, Zn dendrite growth, corrosion, and side reactions severely impair the performance of rechargeable ZIBs. To deal with these issues, a profound understanding of the mechanism of the matter occurring in electrochemical cycles is essential to thoroughly solve the challenges. Instead of focusing solely on techniques for improving the performance of Zn metal anodes, this review delves into and summarizes the causes of side reactions and dendrite formation, thereby establishing a logical system of methodologies for improving the electrochemical performance of mild aqueous ZIBs. The correlation between the Zn metal anode, aqueous electrolyte, separators and the performance of ZIBs is also discussed in detail. There is also a brief perspective on the future development of Zn metal anodes in aqueous solutions. This study sheds a light on the challenges associated with the construction of highperformance ZIBs, which will significantly aid in their practical implementation.

show abstract

Structural influence of nitrogen-containing groups on triphenylmethane-based levelers in super-conformal copper electroplating

Cited by 27 publications

References 42 publications

Strong Convection-Dependent Adsorption of Phenothiazine Skeleton Levelers and Their Application in Copper Electroplating

Strong Convection-Dependent Adsorption of Phenothiazine Skeleton Levelers and Their Application in Copper Electroplating

Experimental and Theoretical Study of the New Leveler Basic Blue 1 during Copper Superconformal Growth

Improving the Performance of Aqueous Zinc‐ion Batteries by Inhibiting Zinc Dendrite Growth: Recent Progress

Contact Info

Product

Resources

About