Structural influence of copper substrate on magnetic properties of electrodeposited CoPtP films for MEMS applications

Abstract

Hard magnetic CoPtP films for MEMS application were electrodeposited on the various structures of copper substrate such as copper foil, copper seed layer and nano porous copper layer. The structural influence of copper substrates provided a reasonable explanation for the correlation of the magnetic properties of electrodeposited CoPtP alloy, because magneto-crystalline anisotropy could account for the enhancement of the perpendicular magnetic properties (Coercivity in highest range is achieved from 9.1 to 14.9 KOe) of the films. Also the influence of deposition current density on the chemical composition that changes the growth morphology, microstructure, and magnetic properties are studied.