Structural Finite Element Evaluation of Twisted Stacked-Tape Cables for High-Field Magnets

Allen, N.; Pierro, Federica; Zhao, Zijia; Chiesa, L.; Takayasu, M.

doi:10.1109/tasc.2017.2652304

Cited by 15 publications

(9 citation statements)

References 16 publications

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“…The cable is studied in the untwisted configuration but the stack was oriented at 45 degrees, which was shown to be the most critical orientation for the tapes in the stack when they experience accumulating electromagnetic loads [6].…”

Section: Finite Element Analysismentioning

confidence: 99%

“…A mesh study was performed in [6] and the optimal mesh was determined to be such that the element size for the HTS tapes was 0.1 mm along its width, resulting in 40 elements for a 4-mm wide tape. Each tape was meshed with only one element through the thickness and with an element size of 0.2 mm along its length, resulting in 50 elements for a 10-mm long stack.…”

Section: Element Type and Mesh Densitymentioning

confidence: 99%

“…The results were analysed considering the width and thickness directions of the stack of the tapes (see figure 2). Surface to surface contact pairs were used to described the interaction between tapes and between the stack and the support structure as described in [6]. Following some studies performed in [6], a friction coefficient of 0.2 was used between the tapes of the stack.…”

Section: Boundary Conditions and Loadingmentioning

confidence: 99%

“…This large, accumulating transverse electromagnetic compression is due to the interaction between the high currents and the large magnetic field generated in the magnets utilizing those cables. In previous work [6], the effect of electromagnetic transverse compression on an untwisted 40-tape TSTC was investigated using numerical finite element analysis. Two support methods were investigated: a solid cylindrical copper core and a solder filled copper tube (figure 1).…”

Section: Introductionmentioning

confidence: 99%

“…Therefore, the stress values reported in the result sections should not be interpreted as absolute value for a specific solution, but as a tool to guide the design process and avoid critical situations. The studies on the conductor originally presented in [6] for the solder filled tube configuration and covering electromagnetic loads up to 300 kN/m, were expanded to consider loads up to 1000 kN/m. The effect on the stress distribution in the stack was investigated as a function of the following parameters: thickness and outer diameter dimensions of the copper tube (solder filled configuration), conductor width and structural surrounding material (solid copper core and solder filled configurations).…”

Section: Introductionmentioning

confidence: 99%

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Finite element investigation of the mechanical behaviour of a Twisted Stacked-Tape Cable exposed to large Lorentz loads

Pierro

Zhao

Chiesa

et al. 2017

IOP Conf. Ser.: Mater. Sci. Eng.

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Abstract. The mechanical response of Twisted Stacked-Tape Cables (TSTC) experiencing large Lorentz loads generated during its operation in high-current, high-field magnets was investigated using finite element analysis. Two conductor configurations were investigated: a stack of 40 REBCO tapes inside a solid cylindrical copper rod (former) and a solder filled copper tube. Several simulations were conducted to highlight the effect of different parameters in the cable and the differences between the two configurations. A parametric study on the geometrical parameters of the solder filled tube configuration was performed. It was found that increasing the ratio between the thickness of the copper tube and the amount of solder in the cross section lowers the maximum stress experienced by the stack of tapes. Another simulation explored the effect of using different width tapes in the stack and it was found that, for a given Lorentz load, a wider tape reduces the maximum stress experienced by the stack. In certain applications, the cable requires the addition of material for structural support or stability reasons therefore a simulation was performed to understand the effect of copper surroundings. It was found that surrounding the cable with copper as well as using a thick copper tube lowers the stress experienced by the stack and makes the behaviour of the copper core and the solder filled tube configurations almost identical. Finally, the critical current performance of the TSTC conductors as a function of Lorentz load was estimated. A minimal degradation below 2% was predicted for the copper core configuration up to 1000 kN/m and up to 600 kN/m for the solder filled tube configuration.

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Section: Finite Element Analysismentioning

confidence: 99%

Section: Element Type and Mesh Densitymentioning

confidence: 99%