The
ability to deposit thin and conformal films has become of great
importance because of downscaling of devices. However, because of
nucleation difficulty, depositing an electrically stable and thin
conformal platinum film on an oxide nucleation layer has proven challenging.
By using plasma-enhanced atomic layer deposition (PEALD) and TiO
2
as a nucleation layer, we achieved electrically continuous
PEALD platinum films down to a thickness of 3.7 nm. Results show that
for films as thin as 5.7 nm, the Mayadas–Shatzkes (MS) model
for electrical conductivity and the Tellier–Tosser model for
temperature coefficient of resistance hold. Although the experimental
values start to deviate from the MS model below 5.7 nm because of
incomplete Pt coverage, the films still show root mean square electrical
stability better than 50 ppm over time, indicating that these films
are not only electrically continuous but also sufficiently reliable
for use in many practical applications.