Structural Design and Property Study on Flexible Electronic Films with High Heat Resistance and Friction Durability

Abstract

To improve both thermal stability and friction durability of flexible electronic films with nano‐Ag, a series of flexible films with dendric nano‐Ag embedded into high thermally stable 2‐adamantane containing poly(aryl ether ketone) (2‐ADMPEK, PAEK) substrates are prepared in this work. These films are named as PAEK‐dnAg. The dendric nanostructure of Ag conductive layer performs excellent conductivity with sheet resistance as low as 0.3959 Ω ◻−1. The wide‐angle X‐ray diffraction and scanning electron microscope (SEM) results show dendric nano‐Ag layer well incorporated to PAEK substrates. The results of thermal stability, hydrolysis–oxidation test, adhesion test, and friction durability indicate the PAEK substrate can effectively protect dendric nanosilver conductive layer from heat, harsh oxidation, and friction. The SEM images further show the dendric embedded structure can remain almost unchanged after high temperature (400 °C) heating in air, water boiling oxidation for 12 h, 2500‐cycle 3M tape peeling test, and harsh friction with sanding paper under 5 N, which should lead to the excellent durability of PAEK‐dnAg samples in harsh condition. Thus, PAEK‐dnAgs may show great potential in flexible electronic films application for harsh condition such as high temperature, hydrothermal environment or high friction.