Structural Defects in Copper and the Electrical Resistivity Minimum

Blewitt, T.H.; Coltman, R.R.; Redman, J. K.

doi:10.1103/physrev.93.891

Cited by 31 publications

(10 citation statements)

References 4 publications

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“…which agrees with the measurements by Blewitt et al [ 2 ] . Basinski Experiments to check equation ( 2 ) have been made on polycrystalline f.c.c.…”

Section: (3)supporting

confidence: 91%

“…4 "K the first double measurement could, however, be made only after annealing a t 90. 2 "K so that in order to determine the resistivity increase immediately after deformation it was necessary to take into account the recovered part of the resistivity, which could be done in a very exact way because of the unchanged geometry of the sample. The values chosen for B were derived from the resistivity decreases up to 290 "K recorded for the respective samples a t both measuring temperatures.…”

Section: A1mentioning

confidence: 99%

See 1 more Smart Citation

Resistivity Change of Point Defects during Work Hardening of High‐Purity Copper

Thom¹

1970

Physica Status Solidi (b)

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“…which agrees with the measurements by Blewitt et al [ 2 ] . Basinski Experiments to check equation ( 2 ) have been made on polycrystalline f.c.c.…”

Section: (3)supporting

confidence: 91%

Section: A1mentioning

confidence: 99%

Resistivity Change of Point Defects during Work Hardening of High‐Purity Copper

Thom¹

1970

Physica Status Solidi (b)

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“…(55) cold worked high purity single crystal wire of copper and found that the resistance minimum appeared after the wire was annealed and recrystallized. (55) cold worked high purity single crystal wire of copper and found that the resistance minimum appeared after the wire was annealed and recrystallized.…”

Section: Resistivity Minimummentioning

confidence: 99%

The Solid State

Blatt¹,

Tomizuka²,

Slifkin³

1956

Annu. Rev. Phys. Chem.

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In writing this review, space limitations faced the authors with a choice between presenting an annotated bibliography covering a large area of solid state research on the one hand, or writing a review article in which only a rather small segment of the field would be discussed in a somewhat more detailed and systematic manner. We have decided to adopt the latter proce dure.The selection of topics was based in large measure on a desire to r�view the fields in which substantial progress has been made in recent years so that these pages might serve the purpose of synthesizing a large body of experi mental and theoretical knowledge. In part, the topics presented also reflect the interests of the authors. POINT IMPERFECTION IN METALS VACANCIES AND INTERSTITIALSNumerous approaches have been made in the past few years to investigate the nature of vacancies and interstitials in metals. These approaches can generally be classified into two major categories: 1. that which makes use of imperfections present in metals in thermal equilibrium, and 2. that which employs some method of introducing excess imperfections.Volume diffusion.-The typical example of the first approach is the measurement of volume diffusion in pure metals. A review article by Kleppa (1) and an article by Lazarus (2) give sufficient background in the recent development in this field. The activation energy ED of a diffusion process gives the sum of the energy Ef required to form an imperfection and the en ergy Em which is the activation energy for the motion of a diffusing atom into an adjacent imperfection. Some experiments have been proposed to identify the nature of the imperfections (3, 4, 5) i.e., to see whether vacancies or 1 The survey of the literature pertaining to this review was completed in De cember, 1955.

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“…As expected, the cumulative p, for a given total 6p for Group 2 samples is larger than those for Groups 3 and 4, and the data for e^ = 0.20 and 0.30% strain per cycle give essentially the same cumulative data. Since the stresses to produce e t = 0.30% are considerably larger than those for 0,20%, the near coincidence of the pd-versus-£e p data is further The data of Blewitt et al 12 for tensile loading in single crystals of copper gives n=2 and a=0.1 μ^cm, whereas a review of data from polycrystalline samples 23 concludes that n=* 3/2 and a = 0.05 ^β*cm. The present data for cyclic strains give pj = 0.024 ixfi-cm Se p <82 for the Group 2 texture and p^ = 0.017 μ^cm Se p ' 71 for the (ill) texture.…”

Section: Comparison With Unidirectional Deformationmentioning

confidence: 92%

“…% Frenkel pair. 16 The most definitive data regarding defects produced by plastic deformation of copper at 4.2 K have emerged from the single-crystal studies of Blewitt et al 12 These studies showed that (l) the p^ after deformation at 4.2 K t is dependent on the square of resolved shear stress on the primary glide system, (2) the shear stress to attain a given shear strain is significantly dependent on whether single-or multiple-slip systems are operating, and (3) no significant annealing, or decrease in p^ produced at 4.2 K, occurs at T < 78 K. Points 1 and 2 established the importance of the dislocation interactions, rather than strain alone, in determining the number of point defects. The third point established that the defects were primarily vacancies, since single interstitials should be mobile and thus cause P^ to decrease at T -c 78 K.…”

Section: Defect Resistivitymentioning

confidence: 99%