Abstract:The development of CuSn intermetallic compound (IMC) at the solder/Cu joints interface had been studied using five Pb-free solders as SnAg3.0Cu0.5, SnAg3.5Cu0.7, SnAg1.0Cu0.5Bi1.0, SnAg1.5Cu0.7In9.5 and SnCu0.67In2.0 alloys (composition given in mass%). The effects of Bi and In additions on the intermetallic phase formation in the lead-free solder joints with copper substrate were studied. The soldering of the copper plate was conducted at 250°C for 5 s. The solder joint reliability of SnAg3.0Cu0.5 and SnCu0.6… Show more
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