Structural and phase changes in iron-on-silicon treated by compression plasma flows

Effect of Compressed Plasma Flow on Tantalum-Titanium Thin Layer Deposited on Silicon Substrate

“…The CPF can be used as a surface alloying tool capable of processing a coating/substrate system (e.g., a 1-5 µm thick film deposited on a substrate). In this process, a deep alloying of the substrate (~10 -25 µm) by elements of the coating can be achieved, with solid solutions and chemical compounds being made between elements of the substrate and the coating [15][16][17][18]. The resulting surface properties are unlikely to be reproduced by available techniques.…”

“…Among the broad range of research areas related to the use of CPF, particular interest is being shown in the creation of new materials based on silicon, namely, metal silicides [16,17,19]. Silicides are widely used in micro and nano and optoelectronics and are applied as catalysts in the formation of nanotubes.…”

“…Thermal, mechanical, and radiation effects of CPF pulses provide nonequilibrium conditions for structural and phase transformations and the formation of novel low-dimensional structures in the surface layers of solids. CPF treatment of a thin metal layer (e.g., Fe, Ti, Ni, Zr, Mo) on a silicon substrate successfully made it possible to form metal silicides in the near-surface layer [16,[19][20][21].…”