Structural and mechanical characteristics of some lead-free Cu-Sn based solder alloys

Abstract

The results of structural and mechanical characteristics of lead-free Cu-Sn based solder alloys, produced in Company "11. mart" AD Srebrenica (Republic of Srpska), are presented in this paper. The results of investigation of samples - alloys CuSnl4, CuSnlFelAlO.5, CuSnlOFelAllMnO.5 and CuA110Fe3Mn produced by different processing methods, include the data obtained by optical microscopy and measurements of hardness, micro hardness and electroconductivity, in order to characterize mentioned alloys and define the influence of processing method applied on their structural and mechanical properties. Microstructural experimental results of samples produced by casting in a metal mould with fast water cooling showed clearly sharp dendritic structure. Samples obtained by casting in a sand mould, displayed structure with big crystals, higher amount of segregation and inclusions on the grain boundaries, as a result of the slow cooling process. Hardness and microhardness tests showed increasing values as the amount of tin raised. Sample 3 showed the lowest value, as a result of the crystallization process and lackness of additional thermal treatment. Experimental results of the electroconductivity test showed that mentioned sample has got the highest value, which can be also explained by its production method. Results presented in this paper can contribute to investigations of copper-tin lead-free alloys, having in mind that various potential lead-free solders still haven't been completely investigated from the aspects of their structural, mechanical and electrical properties