1993
DOI: 10.1063/1.354822
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Structural and electrical properties of reactively sputtered InN thin films on AlN-buffered (00.1) sapphire substrates: Dependence on buffer and film growth temperatures and thicknesses

Abstract: An extensive investigation of InN overlayers on AlN-buffered (00.1) sapphire by reactive magnetron sputtering has been undertaken and the dependencies of several basic materials properties (film thickness, development and quality of heteroepitaxy, film morphology, and electrical transport) on such key deposition parameters such as the growth temperatures of the insulating AlN buffer layer and the InN overlayer and their thicknesses have been determined. Three prominent effects of the AlN buffer layer are (1) t… Show more

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Cited by 32 publications
(8 citation statements)
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“…It is known that usually the insertion of an AlN buffer layer leads to an improvement of the subsequent III-nitride crystalline quality, which is valid also for RF reactive sputtering technique [18][19][20][21]. It has also been reported that biasing the substrate can lead to an improvement of the structural quality of RF-sputtered AlN through an increase in the kinetic energy of the impinging ions [22].…”
Section: Introductionmentioning
confidence: 86%
“…It is known that usually the insertion of an AlN buffer layer leads to an improvement of the subsequent III-nitride crystalline quality, which is valid also for RF reactive sputtering technique [18][19][20][21]. It has also been reported that biasing the substrate can lead to an improvement of the structural quality of RF-sputtered AlN through an increase in the kinetic energy of the impinging ions [22].…”
Section: Introductionmentioning
confidence: 86%
“…This can be understood by the fact that the grain size obtained in thick AlN layers deposited using the same conditions as the buffer layer is~40 nm, significantly larger than the buffer layer thickness. Thus a non-homogeneous surface coverage can be expected in a three dimensional growth model [26]. The increase of the buffer layer thickness to 30 nm enables the total suppression of the interface damage (no diffraction peak at 2θ~35°) and leads to a reduction of the FWHM of the AlN(0002) reflection peak to 1.63°, to be compared to FWHM = 1.91°for the optimized unbiased layer (see …”
Section: Two-step Deposition Methodsmentioning
confidence: 99%
“…The behavior of pure InN growth might help to shed light on the mechanism of the formation of high concentration of InN in the ternary. InN has been prepared by various techniques [6][7][8][9][10][11][12][13]. However, InN normally shows poor optical properties, a high background carrier concentration and poor crystalline properties with indium clusters found from the x-ray diffraction spectrum.…”
Section: Introductionmentioning
confidence: 99%