Structural Analysis of Phase Change Materials (PCMs)/Expanded Graphite (EG) Composites and Their Thermal Behavior under Hot and Humid Conditions

Yang, Kai; Zhang, Xiuling; Venkataraman, Mohanapriya; Wiener, Jakub; Palanisamy, Sundaramoorthy; Sozcu, Sebnem; Tan, Xiaodong; Dana, Kausik; Zhu, Guocheng; Yao, Juming; Militký, Jiřı́

doi:10.1002/cplu.202300081

Cited by 6 publications

(2 citation statements)

References 49 publications

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“…Additionally, expanded graphite (EG) can be synthesized easily and affordably by reacting natural flake graphite with an interlaminar agent and then expanding the graphite sheets at a high temperature; this increases the specific surface area of the graphite sheets while retaining the above-mentioned advantageous properties of graphite. After the expansion process, a portion of the graphite reacts with the oxidation phase to generate functional groups on the EG surface, thereby providing it with good mechanical properties and potential modification sites. − …”

Section: Introductionmentioning

confidence: 99%

Role of Copper Nanoparticles in the Thermal and Mechanical Properties of Expanded Graphite-Reinforced Epoxy Hybrids

Cheng,

Chu,

Jin

et al. 2024

ACS Omega

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Epoxy resin is extensively applied in the electronics and electrical fields because of its outstanding comprehensive performance. However, the low thermal conductivity (TC) limits its application in thermal interface materials. In the present work, epoxy-based hybrid composites with high TC were prepared by using expanded graphite (EG) and copper (Cu) nanoparticles as thermally conductive hybrid fillers via hot blending and compression-curing processes. Additionally, the influence of the Cu content on the thermal properties, mechanical properties, and morphology of each epoxy/EG/Cu composite was investigated. According to the results, the epoxy/EG/Cu composite showed a maximum TC of 9.74 W/(m·K) at a fixed EG content of 60 wt % owing to the addition of 10 wt % Cu. After the addition of 10 wt % Cu, the flexural strength, flexural modulus, and impact strengths of epoxy/EG/Cu composites were improved from 27.9 MPa, 9.72 GPa, and 0.81 kJ/m2 to 37.5 MPa, 10.88 GPa, and 0.91 kJ/m2, respectively. Hence, this study offers a feasible strategy for the design of epoxy hybrid composites with excellent TC that can be applied to thermal interface materials.

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Section: Introductionmentioning

confidence: 99%

Role of Copper Nanoparticles in the Thermal and Mechanical Properties of Expanded Graphite-Reinforced Epoxy Hybrids

Cheng,

Chu,

Jin

et al. 2024

ACS Omega

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“…To avoid leakage of PCMs for enhancement in thermal stability, the supporting materials to enclose PCMs are necessary. According to this principle, three strategies are proposed: microencapsulation PCMs (MPCMs), [11,12] solid‐solid PCMs (SSPCMs) [13] and form‐stable PCMs (FSPCMs) [14–17] . MPCMs are shell‐core structure, where shell consists of materials with high thermal stability and core consists of PCMs [18] .…”

Section: Introductionmentioning

confidence: 99%

Sandwich Fibrous PEG Encapsulations for Thermal Energy Storage

et al. 2023

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Phase change materials (PCMs) textiles have been developed for personal thermal management (PTM) while limited loading amount of PCMs in textiles reduced thermal buffering effect. In this work, we proposed a sandwich fibrous encapsulation to store polyethylene glycol (PEG) with PEG loading amount of 45 wt %, which consisted of polyester (PET) fabrics with hydrophobic coating as protection layers, polyurethane (PU) nanofibrous membranes as barrier layers and PEG‐loaded viscose fabric as a PCM‐loaded layer. The leakage was totally avoided by controlling weak interfacial adhesion between protection layer and melting PEG. The sandwich fibrous PEG encapsulations had an overall melting enthalpy value ranging from 50 J/g to 78 J/g and melting points ranging from 20 °C to 63 °C by using different PEGs. Besides, introduction of Fe microparticles in PCM‐loaded layer enhanced thermal energy storage efficiency. We believe that the sandwich fibrous PEG encapsulation has a great potential in various fields.

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