2014
DOI: 10.1149/2.0011501ssl
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Stretchable Organic Thin-Film Transistors Fabricated on Elastomer Substrates Using Polyimide Stiff-Island Structures

Abstract: We demonstrate stretchable organic thin-film transistors (OTFTs) on a polyimide stiff-island/elastomer substrate. All processes are performed entirely at elastomer-compatible temperatures. We confirm the basic properties of the poly(vinylidene fluoridetrifluoroethylene) [P(VDF-TrFE)] with a poly(methyl methacrylate) (PMMA) blended film on the elastomer substrate and evaluate the characteristics of the fabricated stretchable OTFTs. A field-effect mobility of 3.4 × 10 −3 cm 2 V −1 s −1 , an I on /I off ratio gre… Show more

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Cited by 30 publications
(17 citation statements)
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“…Reproduced with permission. [47] Copyright 2014, The Electrochemical Society. elastomers, which had excellent mechanical properties and electrical properties.…”
Section: Physical Blending Strategies For Stretchable Semiconducting Layermentioning
confidence: 99%
“…Reproduced with permission. [47] Copyright 2014, The Electrochemical Society. elastomers, which had excellent mechanical properties and electrical properties.…”
Section: Physical Blending Strategies For Stretchable Semiconducting Layermentioning
confidence: 99%
“…In recent years, more and more researchers have paid attention to the integration of a conductive thin film with an elastomeric substrate to fabricate stretchable conductors. By designing the structure of the conductive layer as wavy 33 , buckled 40 , wrinkled 41 , serpentine 42 or other configurations [43][44][45] , they managed to take advantage of the electrical performance of the nanoscale fillers and obtain good stretchability. However, most of the approaches used to make stretchable electronic devices are complicated, costly, low-yielding, and difficult to control 33,41,44 .…”
Section: Introductionmentioning
confidence: 99%
“…Recently, much attention has been focused on wearable devices for various new applications that could not be possible with conventional rigid electronics. [1][2][3][4][5][6][7][8][9] To ensure the sufcient functionality, wearable comfortability, and aesthetical acceptability of wearable devices, stretchable electronic packaging technologies with an island-bridge or archipelago con guration, which consists of mechanically disparate soft and hard materials in a single structure, have been proposed. 5,8,[10][11][12][13][14] Flip-chip bonding has been used in the electronic packaging industry for high-density and ne-pitch chip interconnection on exible printed circuit boards (FPCBs) and rigid substrates, such as printed circuit boards (PCBs) and liquid-crystal-display glass substrates.…”
Section: Introductionmentioning
confidence: 99%