2009
DOI: 10.3103/s1063457609060100
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Stress-strain state in the grit-matrix system of a diamond tool under force disturbances

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Cited by 4 publications
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“…where P y is the tensile yield stress for the matrix material; R is the radius of the plastic zone; K m , µ m and α m are the bulk modulus, shear modulus and coefficient of thermal expansion of the matrix respectively; K 1 and α 1 are the bulk modulus and coefficient of thermal expansion of the diamond, respectively; and ∆T is the temperature decrease during cooling. In recent years, numerical computation methods have been widely used to study diamond retention in the matrix, and have been utilized to evaluate thermal residual stresses [92][93][94][95], local plastic deformation [13,96] and interfacial pullout behavior [4,11]. Cracks are easily generated at the interface due to large thermal stresses; a decrease in thermal residual stress is beneficial to diamond retention strength [29].…”
Section: Mechanical Calculation Methodsmentioning
confidence: 99%
“…where P y is the tensile yield stress for the matrix material; R is the radius of the plastic zone; K m , µ m and α m are the bulk modulus, shear modulus and coefficient of thermal expansion of the matrix respectively; K 1 and α 1 are the bulk modulus and coefficient of thermal expansion of the diamond, respectively; and ∆T is the temperature decrease during cooling. In recent years, numerical computation methods have been widely used to study diamond retention in the matrix, and have been utilized to evaluate thermal residual stresses [92][93][94][95], local plastic deformation [13,96] and interfacial pullout behavior [4,11]. Cracks are easily generated at the interface due to large thermal stresses; a decrease in thermal residual stress is beneficial to diamond retention strength [29].…”
Section: Mechanical Calculation Methodsmentioning
confidence: 99%