2016
DOI: 10.1109/tasc.2016.2515988
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Stress–Strain Relationship, Critical Strain (Stress) and Irreversible Strain (Stress) of IBAD-MOCVD-Based 2G HTS Wires Under Uniaxial Tension

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Cited by 67 publications
(66 citation statements)
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“…Critical strain (ε c , 95) and irreversible strain (ε irr , 0.99) were unaffected by copper thickness, with intrinsic values of 0.45 and 0.75%. The calculated results are consistent with the measured stress-strain curves, which can be well adapted using the Ramberg-Osgood equation and substrate [71]. Janecska et al show that enraptured pressure imaging can distinguish lithography surrenders in the 70 nm FinFET gadget's development cycle stream.…”
Section: Variation Of Metal Characteristics Under Differentsupporting
confidence: 69%
“…Critical strain (ε c , 95) and irreversible strain (ε irr , 0.99) were unaffected by copper thickness, with intrinsic values of 0.45 and 0.75%. The calculated results are consistent with the measured stress-strain curves, which can be well adapted using the Ramberg-Osgood equation and substrate [71]. Janecska et al show that enraptured pressure imaging can distinguish lithography surrenders in the 70 nm FinFET gadget's development cycle stream.…”
Section: Variation Of Metal Characteristics Under Differentsupporting
confidence: 69%
“…Above this limit there is a risk of reduction in the critical superconducting current capacity as well as delamination of the internal layers within the HTS tape (Zhang et al. 2016). Regardless, the optimization framework can take arbitrary strain limits as input, and results are generally given in terms of peak predicted .…”
Section: Winding Angle Optimization Methodsmentioning
confidence: 99%
“…In the LNI coil, the maximum stress in the copper sheet is 255 MPa, and the maximum stress in the polyimide sheet is 14 MPa. However, the yield stresses of copper and polyimide can be 340 and 69 MPa, respectively [53,54]. The simulation results show that the LNI winding approach cannot enhance the risk of mechanical damage of the coil under this operating condition.…”
Section: Stress Induced By the Cooling Process And Lorentz Forcementioning
confidence: 99%
“…The equivalent elastic modulus, Poisson's ratio, and thermal expansion coefficient can be estimated by the homogenization method[52]. Detailed mechanical parameters for different conductor materials are shown in Tables 2[53][54][55][56][57][58][59][60][61][62] and 3 . Note that the mechanical equations are also solved by commercial FEM software COMSOL.…”
mentioning
confidence: 99%