Stress-strain numerical simulation for a microprofile subjected to orthogonal impact under constrained loading conditions

Abstract

The present paper aims to describe shape changes in a microroughness model developed for the working surfaces of parts at degrees of deformation commensurate with the height of the original microprofile; to establish how the degree of microprofile upsetting affects its shape under constrained loading conditions; as well as to estimate the stress state of the microprofile by stress intensity. A numerical model describing the surface microprofile of parts was calculated using the ANSYS Workbench environment. Lead, tin, aluminum, and copper were used as microprofile materials. In addition, microprofile upsetting was computer simulated under constrained loading conditions. The valley bottom was found to rise at a 10–20% microprofile upsetting by 0.213–0.275 mm relative to the original profile height, depending on its material. The relative length of the smoothed microprofile section amounted to 0.786–0.925 mm of its original length. The base angle of the deformed microprofile reached 570 and 800 for copper and lead models, respectively. The depth of valleys ranged from 1.4 mm (23% of the original profile height) for lead models and from 1.8 mm (30% of the original profile height) for copper models. In the case of maximum microprofile upsetting, an increase in the yield strength of microrough material from 10 to 60 MPa contributed to a reduction in the base angle of the deformed microprofile, as well as relative length and the vertical rise of microprofile valleys at their highest point. No interlocking of lateral microprofile surfaces was observed. At a 50% upsetting, the stress state of the microprofile exceeded its ultimate strength by 4–8 times. The shape changes simulated for the microprofile from plastic metallic materials are described. The performed numerical simulation correlates well with the experimental results obtained for lead microprofile models. It is worth noting that the complete smoothing of the microprofile is likely to occur through the rise of valleys and the approaching of its lateral surfaces. The study results can be used for designing and manufacturing valve gate assemblies.