Stress Relaxation and Fatigue of Two Electromechanical Spring Materials Strengthened by Thermomechanical Processing

Fox, A

doi:10.1109/tpmp.1971.1136441

Cited by 17 publications

(1 citation statement)

References 6 publications

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“…The relaxation of the contact springs is a common electrical connector property that plays an important role in terms of automobile safety. The contact force of a connector spring decreases due to its aging process [1]. Exceeding of a critical force limit leads to connector failure.…”

Section: Introductionmentioning

confidence: 99%

A MEMS sensor for microscale force measurements

Majcherek

Aman

Fochtmann

2016

J. Micromech. Microeng.

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This paper describes the development and testing of a new MEMS-based sensor device for microscale contact force measurements. A special MEMS cell was developed to reach higher lateral resolution than common steel-based load cells with foil-type strain gauges as mechanical-electrical converters. The design provided more than one normal force measurement point with spatial resolution in submillimeter range. Specific geometric adaption of the MEMS-device allowed adjustability of its measurement range between 0.5 and 5 N. The thin film nickel-chromium piezo resistors were used to achieve a mechanicalelectrical conversion. The production process was realized by established silicon processing technologies such as deep reactive ion etching and vapor deposition (sputtering). The sensor was tested in two steps. Firstly, the sensor characteristics were carried out by application of defined loads at the measurement points by a push-pull tester. As a result, the sensor showed linear behavior. A measurement system analysis (MSA1) was performed to define the reliability of the measurement system. The measured force values had the maximal relative deviation of 1% to average value of 1.97 N. Secondly, the sensor was tested under nearindustrial conditions. In this context, the thermal induced relaxation behavior of the electrical connector contact springs was investigated. The handling of emerging problems during the characterization process of the sensor is also described.

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Section: Introductionmentioning

confidence: 99%