Stress-Induced Grain Boundary Migration in Polycrystalline Copper

Abstract

We use three-dimensional (3D) grain-continuum models to study grain boundary migration, treating each grain with anisotropic elastic properties. Grain boundary speeds are computed using a finite element method to calculate differences in strain energy density across grain boundaries. Bodyfitted finite element meshes are used. An interface tracking program, PLENTE, is used to develop starting structures and move the grain boundaries based on these speeds. We demonstrate this procedure on textured films consisting of h100i and h111i fiber textured film. We also apply the model to a short section of a Cu line embedded in oxide. We conclude with a discussion on the relative impact of different driving forces for grain boundary motion.

Determining the Parameters of Importance of a Graphene Synthesis Process Using Design-of-Experiments Method

“…This FEA is performed using thermal and static-structural analysis in ANSYS 16.2 Academic Version (ANSYS, Inc., Canonsburg, PA, USA, 2015). The material properties used for FEA [49][50][51][52][53][54] are mentioned in Table S1 of the Supplementary Materials. Here, the resultant stress is given by Equation (1) and is popularly known as Stoney's equation [55,56].…”