Stress generation by electromigration

Blech, I. A.; Herring, Conyers

doi:10.1063/1.89024

Cited by 487 publications

(204 citation statements)

References 8 publications

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“…Electromigration (EM) is known to introduce back stress in confined short stripes of Al interconnects [1,2]. When the atoms move from the cathode to the anode in the stripe under high electric current density, tensile and compressive stresses will be established at the cathode and the anode, respectively.…”

Section: Introductionmentioning

confidence: 99%

In situ measurement of electromigration-induced transient stress in Pb-free Sn–Cu solder joints by synchrotron radiation based x-ray polychromatic microdiffraction

Chen

Tamura

Kunz

et al. 2009

Journal of Applied Physics

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Electromigration-induced hydrostatic elastic stress in Pb-free SnCu solder joints was studied by in situ synchrotron X-ray white beam microdiffraction. The elastic stresses in two different grains with similar crystallographic orientation, one located at the anode end and the other at the cathode end, were analyzed based on the elastic anisotropy of the β-Sn crystal structure. The stress in the grain at the cathode end remained constant except for temperature fluctuations, while the compressive stress in the grain at the anode end was built-up as a function of time during electromigration until a steady state was reached. The measured compressive stress gradient between the cathode and the anode is much larger than what is needed to initiate Sn whisker growth. The effective charge number of β-Sn derived from the electromigration data is in good agreement with the calculated value.3

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Section: Introductionmentioning

confidence: 99%

In situ measurement of electromigration-induced transient stress in Pb-free Sn–Cu solder joints by synchrotron radiation based x-ray polychromatic microdiffraction

Chen

Tamura

Kunz

et al. 2009

Journal of Applied Physics

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“…Ti is often present in the substrate or in the passivation layer, 20,21 whereas the addition of a small amount of Zr to a Al-Cu alloy leads to a decrease of the lifetime. 21 As for the noble-metal alloying elements, their influence on the electromigration behavior cannot be explained using these calculations only.…”

Section: Other Alloying Elementsmentioning

confidence: 99%

Calculation of the electromigration wind force in Al alloys

et al. 1999

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The electromigration wind force in various Al alloys is calculated using a Green's-function method for the calculation of the electronic structure. The influence of the environment of the jumping atoms is studied in detail in the Al-Cu alloy. Alloys of Al with 3d and 4sp alloying elements are studied systematically in order to investigate the relation between the electronic states of the alloying atom and the wind force. The study also includes several other alloys, which have been used in the past in attempts to increase electromigration lifetime. It is shown that the wind force on an Al host atom can be changed considerably by the presence of an alloying atom at particular positions near the jump path. This could be an additional contribution to the well-known decelerating effect of some alloying elements on electromigration in Al. ͓S0163-1829͑99͒01112-1͔

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“…This will result in the development of an electromigration-induced stress gradient along the line, with a tensile stress at the cathode end where material is depleted and a compressive stress at the anode end where the material is accumulated. [14] [15] [16] For lines below a certain critical length (Blech length), the stress gradient will eventually counterbalance the effect of electromigration as it creates a chemical potential causing the material to diffuse in the opposite direction, and no electromigration damage is observed (concept of immortal lines). Lines of length above the Blech length are subject to failure either by open circuit at the cathode or short circuit at the anode, when the compressive stress cause a crack in the passivation layer and the metal is extruded and comes into contact with neighboring metallizations.…”

Section: Electromigration In Passivated Al(cu) Interconnect Linesmentioning

confidence: 99%

Synchrotron X-Ray Microdiffraction Studies of Electromigration in Interconnect lines at the Advanced Light Source

Tamura¹,

Chen²,

Kunz³

et al. 2009

AIP Conference Proceedings

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Synchrotron polychromatic X-ray microdiffraction is a particularly suitable technique to study in situ the effect of electromigration in metal interconnects as add spatial resolution to grain orientation and strain sensitivity. This technique has been extensively used at the Advanced Light Source to monitor changes in aluminum and copper interconnect test structures while high-density current is passed into them during accelerated tests at elevated temperature. One of the principal findings is the observation of electromigrationinduced plasticity in the metal lines that appear during the very early stages of electromigration. In some of the lines, high density of geometrically necessary dislocation are formed leading to additional diffusion paths causing an enhancement of electromigration effect at test temperature.

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Stress generation by electromigration

Cited by 487 publications

References 8 publications

In situ measurement of electromigration-induced transient stress in Pb-free Sn–Cu solder joints by synchrotron radiation based x-ray polychromatic microdiffraction

In situ measurement of electromigration-induced transient stress in Pb-free Sn–Cu solder joints by synchrotron radiation based x-ray polychromatic microdiffraction

Calculation of the electromigration wind force in Al alloys

Synchrotron X-Ray Microdiffraction Studies of Electromigration in Interconnect lines at the Advanced Light Source

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