Stress evolution during ultrasonic Al ribbon bonding

Ando, Masaya; Takashima, Kazumasa; Maeda, Masakatsu; Takahashi, Yasuo

doi:10.1088/1757-899x/61/1/012005

Cited by 3 publications

(5 citation statements)

References 6 publications

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“…The antibacterial activities were in proportion to released silver amount. Ando et al reported that the calcium phosphate coating containing a small amount of silver effectively inhibited bacterial adhesion and had excellent antibacterial activity without any detectable cytotoxicity [7] . However, Eto et al reported that a significant high level of cytotoxicity was observed when the cells were cultured on the calcium phosphate coating containing a large amount of silver [9] .…”

Section: Resultsmentioning

confidence: 99%

“…These were then kept undisturbed for 48 hours at 37 o C. The concentration of silver in each immersion medium was measured by inductively coupled plasma mass spectrometry (ICP-MS, Agilent7500cs; Agilent Technologies, California, USA). The antibacterial activities of AgHA sintered at 800 to1200°C were examined according to modified ISO 22196 ((bovine serum was used as medium at 37 o C [7] ) using methicillin -resistant Staphylococcus aureus (MRSA, UOEH6)).…”

Section: Methodsmentioning

confidence: 99%

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Characterization of Structural and Chemical Properties of Silver Containing Hydroxyapatite Synthesized by Solid Phase Reaction

Murakami

Noda

Ikeda

et al. 2016

KEM

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In this study, we investigated the physical and chemical state changes of silver in silver-containing hydroxyapatite (AgHA) composites sintered at various heat treatment temperatures. AgHA composites were synthesized by a solid phase reaction at various temperatures using composite powder prepared by ball-milling commercial highly crystalline hydroxyapatite powder and commercial silver oxide powder. Structural characterization of AgHA was performed by scanning electron microscopy (SEM), X-ray diffraction (XRD), Fourier transform infrared spectroscopy (FT-IR), and X-ray absorption near edge structure (XANES). The XRD measurement showed that peaks of metallic silver or other silver compounds disappeared at 800°C and reappeared at 1000°C. The a-axis of HA obtained by Rietveld analysis expanded drastically at 800°C. Furthermore, the SEM images showed that silver particles disappeared at 800°C and reappeared at 1000°C, as indicated by the XRD patterns. The XANES spectrum of Ag-L3 edge of AgHA sintered at 800°C was different compared to those of other references. These results suggested that calcium ions were substituted by silver ions in AgHA sintered at 800°C, according to the a-axis expansion of HA lattice caused by the substitution of hydroxyl ions by carbonate ions through the heat treatment, based on the FT-IR measurement. In addition, antibacterial tests showed that AgHA containing various chemical states of silver had good antibacterial activities in proportion to released amounts of silver.

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Section: Resultsmentioning

confidence: 99%

Section: Methodsmentioning

confidence: 99%

Characterization of Structural and Chemical Properties of Silver Containing Hydroxyapatite Synthesized by Solid Phase Reaction

Murakami

Noda

Ikeda

et al. 2016

KEM

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“…On the other hand, the ribbon bonding exhibited a different mode [98]. The detailed measurements regarding vibration, displacement, and contact interface growth have been reported in a previous paper [96,98,101]. Only the result of the growth process of the bond area is discussed here.…”

Section: Al Ultrasonic Bondingmentioning

confidence: 91%

“…Simultaneously, the interfacial shear stress is enhanced as reported in Refs. [96] and [101]. This means the increase of friction power [87].…”

Section: Al Ultrasonic Bondingmentioning

confidence: 95%

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Solid-State Microjoining Mechanisms of Wire Bonding and Flip Chip Bonding

Takahashi

Fukuda

Yoneshima

et al. 2017

Journal of Electronic Packaging

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Low-temperature microjoining, such as wire (or ribbon) bonding, tape automated bonding (TAB), and flip chip bonding (FCB), is necessary for electronics packaging. Each type of microjoining takes on various aspects but has common bonding mechanisms regarding friction slip, plastic deformation, and friction heating. In the present paper, solid-state microjoining mechanisms in Au wire (ball) bonding, FCB, Al wire bonding (WB), and Al ribbon bonding are discussed to systematically understand the common bonding mechanisms. Ultrasonic vibration enhances friction slip and plastic deformation, making it possible to rapidly obtain dry interconnects. Metallic adhesion at the central area of the bonding interface is mainly produced by the friction slip. On the other hand, the folding of the lateral side surfaces of the Au bump, Au ball, and Al wire is very important for increasing the bonded area. The central and peripheral adhesions are achieved by a slip-and-fold mechanism. The solid-state microjoining mechanisms of WB and FCB are discussed based on experimental results.

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Deformation Kinetics of Wiring Ribbons during Ultrasonic Bonding

Maeda

Kitamura

Takahashi

2015

Journal of Smart Processing

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Deformation behavior of high-purity aluminum wiring ribbons during ultrasonic bonding was investigated using a laserDoppler vibrometer, a high-speed laser displacement sensor, and a high-speed video camera. The displacement of the flat-bottom wedge tool was referred to as the index for the deformation of the ribbon. The deformation of the ribbon by applying the bonding force completes immediately. The deformation restarts by the application of the ultrasonic vibration. The deformation induced by ultrasonic vibration does not contain elastic component. Fine initial bond areas are first extended to the direction of the ultrasonic vibration and then they are expanded to the lateral direction. Finally, the bond areas coalesce with each other to form a continuous bond area.

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Stress evolution during ultrasonic Al ribbon bonding

Cited by 3 publications

References 6 publications

Characterization of Structural and Chemical Properties of Silver Containing Hydroxyapatite Synthesized by Solid Phase Reaction

Characterization of Structural and Chemical Properties of Silver Containing Hydroxyapatite Synthesized by Solid Phase Reaction

Solid-State Microjoining Mechanisms of Wire Bonding and Flip Chip Bonding

Deformation Kinetics of Wiring Ribbons during Ultrasonic Bonding

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