Stress During the Electrodeposition of Copper on Copper Substrate

Abstract

The stress in electrodeposits of copper on a copl~er substrate was investigated. Copper strips, coated on one side by petroleum ielly wax mixtures, were used as cathodes and the deflection they suffered during electrodeposition was measured. Maximum deflection was obtained at a current density of 2 amp/dm ~ using 60% wax coating. The deflection does not vary linearly with the time during electrodeposition but becomes linear during anodic attack.