1985
DOI: 10.1016/0025-5416(85)90402-1
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Stress corrosion cracking in aluminium alloy 7075-T651 by discrete crack jumps as indicated by fractography and acoustic emission

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Cited by 13 publications
(7 citation statements)
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“…(a) Martin et al [29] detected similar acoustic emission events occurring during crack propagation for AA7075-T651 in moist air and in 3.5 pct NaCl that are consistent with crack growth occurring by discrete jumps of approximately 200 to 400 nm, which correlated with the crack-arrest markings (striations) on the intergranular fracture surfaces produced in moist air and occasionally on the fracture surfaces generated in 3.5 pct NaCl. (b) Time-lapse video studies of crack initiation and growth from notched AA7150-T6 samples immersed in 0.6M NaCl, [40] which revealed that initial crack growth (K = 5 to 18 MNm À3/2 ) occurred as a series of discreet steps with instantaneous crack growth rates greater than 10 À6 m/s.…”
Section: Sustained-load Cracking In Moist Air and Distilled Watermentioning
confidence: 58%
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“…(a) Martin et al [29] detected similar acoustic emission events occurring during crack propagation for AA7075-T651 in moist air and in 3.5 pct NaCl that are consistent with crack growth occurring by discrete jumps of approximately 200 to 400 nm, which correlated with the crack-arrest markings (striations) on the intergranular fracture surfaces produced in moist air and occasionally on the fracture surfaces generated in 3.5 pct NaCl. (b) Time-lapse video studies of crack initiation and growth from notched AA7150-T6 samples immersed in 0.6M NaCl, [40] which revealed that initial crack growth (K = 5 to 18 MNm À3/2 ) occurred as a series of discreet steps with instantaneous crack growth rates greater than 10 À6 m/s.…”
Section: Sustained-load Cracking In Moist Air and Distilled Watermentioning
confidence: 58%
“…[29] Based on the limited data available, the crack arrest marking spacings generated in saline environments at room temperature also appear to be insensitive to copper content, temper, and loading conditions. However, the spacings in saline solutions at room temperature,~400 to 500 nm, are significantly larger than those observed in moist air or distilled water,~150 nm.…”
Section: A Intergranular Crack Arrest Markingsmentioning
confidence: 97%
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“…(a) Crack arrest markings have been found on intergranular SCC fracture faces for high purity copper-free Al-5.5Zn-2.5Mg, [2,92] low-and high-copper-containing Al-Zn-Mg-Cu alloys in acidified-inhibited saline solutions (AA7018-T651, [93] AA7075-T7351 [34] ) and 0.6 M NaCl (AA7075-T651 [94] ), that closely resemble those seen on intergranular SCCs generated in moist air or distilled water. [95] (b) Time-lapse video studies of crack initiation and growth from notched AA7150-T6 samples immersed in 0.6 M NaCl, [96] have shown that initial crack growth (K = 5 to 18 MNm À3/2 ) occurs as a series of discreet steps with crack growth rates greater than 10 À6 m/s; (c) Crack propagation for AA7075-T651 in 0.6 M NaCl generated a greater number of electrochemical potential fluctuations (electrochemical noise) with a significant increase in the number of events at low frequencies, [97] which are consistent with the anticipated 10 through 20 second intervals between crack growth increments, based on the spacing between crack arrest marking spacing (200 through 400 nm [93,95] ) and the region 2 SCC growth rate (2 9 10 À8 m/s, Figure 1); and (d) Output from mini-load cells placed in bolts used during DCB SCC tests on AA7075-T651 totally immersed in 0.6 M NaCl showed perturbations in crack length-time measurements.…”
Section: B Mechanistic Implicationsmentioning
confidence: 99%