Stress behaviors and thermal properties of polyimide thin films depending on the different curing process

Chung, Hyunsoo; Lee, Jonghwae; Jang, Wonbong; Shul, Yong Gun; Han, Haksoo

doi:10.1002/1099-0488(20001115)38:22<2879::aid-polb30>3.0.co;2-a

Cited by 30 publications

(12 citation statements)

References 21 publications

(9 reference statements)

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“…14 The details are described in our previous studies. 15,16 The nanohardness tester (MTS XP System) was used to measure the mechanical properties of the polyimide thin films. Berkovich (3-faced pyramid) indenter was used in this study.…”

Section: Measurementmentioning

confidence: 99%

“…This flexible ODA unit may induce relatively easy chain mobility, high thermal expansion coefficient, and lower modulus, which may result in high residual stress in the ODA-based polyimide film. 15,16 Nanoindentation For the different structure polyimide films, the mechanical properties were calculated from load versus displacement curve using the Berkovich nanoindenter. The elastic-plastic behavior of the polyimide thin films with various backbone structures is best illustrated in Figure 3.…”

Section: Residual Stressmentioning

confidence: 99%

“…It is well known that residual stress and mechanical properties of a polymer film are largely determined by its chemical and morphological structures. 15,16 Generally, when a repeating unit of a polymer has a rodlike structure, the toughness and strength should be high because such a structure accompanies large chain orientation along the polymer chain. In contrast, the bent or hinged structure may weaken the intermolecular interactions among polymer chains and prevent effective molecular packing.…”

Section: Residual Stressmentioning

confidence: 99%

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Residual stress and mechanical properties of polyimide thin films

Jang

Seo

Lee

et al. 2009

J of Applied Polymer Sci

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Four different structure polyimide thin films based on 1,4-phenylene diamine (PDA) and 4,4 0 -oxydianiline (ODA) were synthesized by using two different dianhydrides, pyromellitic dianhydride (PMDA) and 3,3 0 ,4,4 0 -biphenyltetracarboxylic dianhydride (BPDA), and their residual stress behavior and mechanical properties were investigated by using a thin film stress analyzer and nanoindentation method. The residual stress behavior and mechanical properties were correlated to the morphological structure in polyimide films. The morphological structure of polyimide thin films was characterized by X-ray diffraction patterns and refractive indices. The residual stress was in the range of À5 to 38 MPa and increased in the following order: PMDA-PDA < BPDA-PDA < PMDA-ODA < BPDA-ODA. The hardness of the polyimide films increased in the following order: PMDA-ODA < BPDA-ODA < PMDA-PDA < BPDA-PDA. The PDA-based polyimide films showed relatively lower residual stress and higher hardness than the corresponding ODA-based polyimide films. The in-plane orientation and molecularly ordered phase were enhanced with the increasing order as follows: PMDA-ODA < BPDA-ODA < BPDA-PDA $ PMDA-PDA. The PDA-based polyimides, having a rigid structure, showed relatively better-developed morphological structure than the corresponding ODA-based polyimides. The residual stress behavior and mechanical properties were correlated to the morphological structure in polyimide films.

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Section: Measurementmentioning

confidence: 99%

Section: Residual Stressmentioning

confidence: 99%

Section: Residual Stressmentioning

confidence: 99%

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Residual stress and mechanical properties of polyimide thin films

Jang

Seo

Lee

et al. 2009

J of Applied Polymer Sci

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“…The residual stresses of PI and PAIs on a Si wafer were measured by a thin fi lm stress analyzer (TFSA). [ 5 ] The samples were heated at a rate of 10 °C min −1 from 25 to 300 °C. A Si(100) wafer with a 76.2 mm diameter, one side of which was polished, was used as the substrate in this study.…”

Section: Residual Stressmentioning

confidence: 99%

“…Therefore, the residual stress is directly connected to the reliability of the product and should be controlled to be the same as that of the substrate. [ 5 ] In the past, extensive research has focused on curing processes and the creation of hybrid materials to reduce the residual stress. However, since the residual stress is highly affected by the structure of the polymer, it is necessary to synthesize a new chemical structure to obtain a lower stress.…”

mentioning

confidence: 99%

The Effects of Amide Groups on the Thermal and Optical Properties of Poly(amide‐imide)s with Low Residual Stress for Microelectronic Devices

Kim

Yoo

et al. 2016

Macro Chemistry & Physics

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In this study, poly(amide-imide)s are synthesized for electronic materials by adding amide groups into polyimide. As it is expected, poly(amide-imide) shows an amorphous structure with a lower glass transition temperature and residual stress than the neat polyimide due to the high steric hindrance of the amide group. Also, the modifi cation to the polyimide structure leads to higher transmittance and enhances colorless properties. Consequently, successful synthesis of poly(amide-imide) s is demonstrated which has wide applicability in the electronic industries due to their low glass transition temperature. It is expected that semiconductor and integrated circuit products can be manufactured utilizing poly(amide-imide)s with high reliability and a low chance of cracking due to their lower residual stress. Furthermore, it envisioned that the improved optical properties of poly(amide-imide) materials will allow for their applications in transparent displays and coating products.

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