Stress behaviors and thermal properties of polyimide thin films depending on the different curing process

Chung, Hyunsoo; Lee, Jonghwae; Jang, Wonbong; Shul, Yong-Gun; Han, Haksoo

doi:10.1002/1099-0488(20001115)38:22<2879::aid-polb30>3.3.co;2-1

Cited by 12 publications

(17 citation statements)

References 0 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Research conducted over the past decade has understood the importance of considering the polymer film morphological contributions to the residual stress as well as its moisture‐induced stress–relaxation behavior of polymer films 5, 17–20. Rigid polymers such as poly( p ‐phenylene pyromellitimide) (PMDA‐PDA) and poly( p ‐phenylene biphenyltetracaboximide) (BPDA‐PDA) showed high chain rigidities and orders with relatively low stress, which are highly required in the fabrication of microelectronic devices 21, 22.…”

Section: Introductionmentioning

confidence: 99%

Analysis of dimensionally stable copolyimide with a low-level residual stress

Chung

Jang

Hwang

et al. 2001

J. Polym. Sci. B Polym. Phys.

Self Cite

View full text Add to dashboard Cite

Section: Introductionmentioning

confidence: 99%

Analysis of dimensionally stable copolyimide with a low-level residual stress

Chung

Jang

Hwang

et al. 2001

J. Polym. Sci. B Polym. Phys.

Self Cite

View full text Add to dashboard Cite

“…The residual stresses of PI and PAIs on a Si wafer were measured by a thin film stress analyzer (TFSA) . The samples were heated at a rate of 10 °C min −1 from 25 to 300 °C.…”

Section: Methodsmentioning

confidence: 99%

“…The residual stress is the most important property in the microelectronics industry because it causes cracking and delamination between the polyimide and substrate. Therefore, the residual stress is directly connected to the reliability of the product and should be controlled to be the same as that of the substrate . In the past, extensive research has focused on curing processes and the creation of hybrid materials to reduce the residual stress.…”

Section: Introductionmentioning

confidence: 99%

The Effects of Amide Groups on the Thermal and Optical Properties of Poly(amide‐imide)s with Low Residual Stress for Microelectronic Devices

Kim

Yoo

et al. 2016

Macro Chemistry & Physics

Self Cite

View full text Add to dashboard Cite

In this study, poly(amide-imide)s are synthesized for electronic materials by adding amide groups into polyimide. As it is expected, poly(amide-imide) shows an amorphous structure with a lower glass transition temperature and residual stress than the neat polyimide due to the high steric hindrance of the amide group. Also, the modifi cation to the polyimide structure leads to higher transmittance and enhances colorless properties. Consequently, successful synthesis of poly(amide-imide) s is demonstrated which has wide applicability in the electronic industries due to their low glass transition temperature. It is expected that semiconductor and integrated circuit products can be manufactured utilizing poly(amide-imide)s with high reliability and a low chance of cracking due to their lower residual stress. Furthermore, it envisioned that the improved optical properties of poly(amide-imide) materials will allow for their applications in transparent displays and coating products.

show abstract

“…The residual stresses of the films were measured with a thin‐film stress analyzer 30–33. The curvatures of the Si wafers with and without films were measured at room temperature with a HeNe laser beam in the temperature range of 25–220 °C.…”

Section: Methodsmentioning

confidence: 99%

Synthesis and characterization of soluble polyimides containing trifluoromethyl groups in their backbone

Kim

Lee

Sundar

et al. 2004

J Polym Sci B Polym Phys

Self Cite

View full text Add to dashboard Cite

A series of polyimides were synthesized from 2,2‐Bis(3,4‐dicarboxyphenyl)hexafluoropropane, 2,2‐bis(3‐amino‐4‐hydroxyphenyl)‐hexafluoropropane, and 4,4′‐oxydianiline by chemical imidization. The effects of the diamine ratios on the properties of the films were evaluated through the study of their thermal, electrical, and morphological properties. All the polymers exhibited better solubility in most of the organic solvents and hence were easily processable. Polyimides with more 2,2‐bis(3‐amino‐4‐hydroxyphenyl)‐hexafluoropropane exhibited better solubility and a low refractive index, which is highly desired for microelectronic applications. The dielectric constant and birefringence were strongly dependent on the fluorine content. With an increase in the fluorine substitution, both the dielectric constant and birefringence decreased. All the polymers exhibited high thermal stability (>400 °C). The absence of crystalline melting in differential scanning calorimetry and broad wide‐angle X‐ray diffraction patterns revealed the amorphous nature of the polymers, which was due to the presence of bulky CF3 groups and hinged ether linkages of the diamine component. The residual stress values decreased with an increase in the 4,4′‐oxydianiline content, and the results were in agreement with the dielectric constant. © 2004 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 42: 4303–4312, 2004

show abstract

Stress behaviors and thermal properties of polyimide thin films depending on the different curing process

Cited by 12 publications

References 0 publications

Analysis of dimensionally stable copolyimide with a low-level residual stress

Analysis of dimensionally stable copolyimide with a low-level residual stress

The Effects of Amide Groups on the Thermal and Optical Properties of Poly(amide‐imide)s with Low Residual Stress for Microelectronic Devices

Synthesis and characterization of soluble polyimides containing trifluoromethyl groups in their backbone

Contact Info

Product

Resources

About