Stress and Fracture Analyses of Solar Silicon Wafers During Suction Process and Handling

Saffar, Saber; Gouttebroze, Sylvain; Zhang, Z. L.

doi:10.1115/1.4029451

Cited by 3 publications

(1 citation statement)

References 13 publications

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“…Typically, these wafers exhibit two principal planes of cleavage {111} and {110}; much research work has been conducted to understand the crack propagation in each direction. The cleavage plane {111} requires the lowest amount of energy for crack propagation, as reported in the literature to be 2.2 J/m 2 [19–26]. The energy required for crack propagation reduces further with micro‐defects in the material that develops during the manufacturing process.…”

Section: Micro‐defects In Solar Wafers/cellsmentioning

confidence: 99%

Multi‐attribute analysis of micro‐defect detection techniques suitable for automated production line of solar wafers and cells

Saleem

Al-Amri

2020

IET Renewable Power Generation

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Renewable energy is going to play an immensely important role in the coming decades. Hence, the bulk manufacturing of solar panels has seen a renewed interest. For this purpose, it is imperatively important to assess the techniques that can be employed on automated production lines for evaluating the quality of solar wafers and cells. To-date many non-destructive testing methods to access the micro-defects in solar wafers and cells have been developed around the globe; however, not all of them can be applied on a fast-paced production line. In this regard, this study details all the nondestructive evaluating techniques that can be employed on an automated production line. Using a multi-attribute decisionmaking method, a strategic evaluation procedure is developed that can be adopted for the optimum selection of evaluation tools currently available in the market. This study is aimed at young researchers, graduate students and practitioners who want to come up-to-speed regarding the various defects that occur in solar wafers and cells along with the techniques that are currently being adopted to evaluate those defects. Also, future trends in research are highlighted regarding the development of assessment techniques.

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Section: Micro‐defects In Solar Wafers/cellsmentioning

confidence: 99%

Multi‐attribute analysis of micro‐defect detection techniques suitable for automated production line of solar wafers and cells

Saleem

Al-Amri

2020

IET Renewable Power Generation

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Analysis of Handling Stresses in Thin Solar Silicon Wafers Generated by a Rigid Vacuum Gripper

Melkote

2015

Journal of Manufacturing Science and Engineering

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Breakage of thin solar silicon wafers during handling and transport depends on the stresses imposed on the wafer by the handling/transport device. In this paper, the stresses generated in solar silicon wafers by a rigid vacuum gripper are analyzed via a combination of experiments and numerical modeling. Specifically, stresses produced in monocrystalline (Cz) and multicrystalline (Cast) silicon wafers of different thicknesses when handled by a vacuum gripper are analyzed using the finite element (FE) method. With the measured surface profiles of the wafer and the gripper as input, the handling process is simulated using FE modeling and the stress distribution obtained. The FE modeling results are validated by experimental data of wafer surface profile during handling. The results show that while the vacuum level does not have significant impact on the stress distribution, the initial surface profiles of the thin wafer and gripper play a dominant role in producing regions of high stress in the wafer.

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Novel and Low-Cost Techniques for Extending the Etch Capabilities of an Inductively Coupled Plasma Etch Tool That Has Clamp Fingers for Clamping 4-Inch Diameter Wafers

Yilmaz

2024

Black Sea Journal of Engineering and Science

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Widening the processing capabilities of an inductively coupled plasma (ICP) etch tool by “preventing wafer breakage” during processing of wafers, or by gaining the capability to do “through-wafer silicon etch” are important challenges that may need to be resolved with very limited resources. Resolving the undesired wafer breakage issues caused during processing of wafers is important to reduce the manufacturing costs, and increase production yield. Furthermore, considering the high prices of the state-of-the-art wafer processing tools, it is also important to prevent wafer breakage by using low-cost approaches especially if the resources for purchasing state-of-the-art processing equipment are not available. Two novel methods (method #1, and method #2) are developed to prevent wafer breakage and allow through-wafer silicon etching. With method #1, an aluminium alloy ring (AAR) and an o-ring are employed to obtain uniform load distribution (instead of point loads) on the required outer region on the surface of a wafer, and to minimize or completely remove the bending moment that may be formed on the possible cross-sections of the entire wafer, during clamping of the wafer. With method #2, through-wafer silicon etching is made possible by simultaneous application of method #1 and addition of a helium cooling gas (HCG) leakage blocking dicing tape at the back side of the wafer that is under processing for through-wafer etching. By using the explained methods, wafer breakage during ICP etch processing is eliminated, and through-wafer silicon etching is made possible. From the other side, the effective wafer area that can be used for processing is reduced by 48%. Novel and capability enabling 2 different techniques that are extremely low-cost compared to purchasing a state-of-the-art ICP etch tool are presented to extend the processing capabilities of an ICP etch tool for deep silicon etching (method #1), and through-wafer silicon etching (method #2).

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Stress and Fracture Analyses of Solar Silicon Wafers During Suction Process and Handling

Cited by 3 publications

References 13 publications

Multi‐attribute analysis of micro‐defect detection techniques suitable for automated production line of solar wafers and cells

Multi‐attribute analysis of micro‐defect detection techniques suitable for automated production line of solar wafers and cells

Analysis of Handling Stresses in Thin Solar Silicon Wafers Generated by a Rigid Vacuum Gripper

Novel and Low-Cost Techniques for Extending the Etch Capabilities of an Inductively Coupled Plasma Etch Tool That Has Clamp Fingers for Clamping 4-Inch Diameter Wafers

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