Strength and electrical conductivity of deformation-processed Cu-15 Vol Pct Fe alloys produced by powder metallurgy techniques

Jerman, G. A.; Anderson, Iver E.; Verhoeven, J. D.

doi:10.1007/bf02669600

Cited by 73 publications

(47 citation statements)

References 8 publications

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“…[23] They also observed that the resistivity of Cu±Fe, after furnace cooling to room temperature, remained high due to a significant amount of dissolved Fe, which did not readily precipitated from solid solution. [23] Slow cooling after heat treatment is therefore known to increase the conductivity of Cu±Fe microcomposites. [12] Verhoeven et al observed that the conductivity of Cu±Fe microcomposites could be increased by promoting precipitation of more Fe through repetitive intermediate heat treatments and slow cooling (15 h cooling to room temperature) during drawing and that the optimum properties for Cu±20 Fe were 62.2 % IACS (International Annealed Copper Standard) and 930 MPa.…”

Section: Optimization Of Strength and Conductivitymentioning

confidence: 91%

“…[1,8] The higher resistivity of Cu±Fe wire is thought to be due to a higher contribution from impurity scattering, r imp . [1,23] The Cu matrix dissolves considerably more Fe than Nb at temperatures above around 250±300 C and Fe has a very large resistivity decrement in Cu. [23] Jerman et al investigated the temperature dependence of the resistivity in Cu±Fe and found that the resistivity increased dramatically starting at around 500 C due to the large contribution of r imp .…”

Section: Optimization Of Strength and Conductivitymentioning

confidence: 99%

“…[1,23] The Cu matrix dissolves considerably more Fe than Nb at temperatures above around 250±300 C and Fe has a very large resistivity decrement in Cu. [23] Jerman et al investigated the temperature dependence of the resistivity in Cu±Fe and found that the resistivity increased dramatically starting at around 500 C due to the large contribution of r imp . [23] They also observed that the resistivity of Cu±Fe, after furnace cooling to room temperature, remained high due to a significant amount of dissolved Fe, which did not readily precipitated from solid solution.…”

Section: Optimization Of Strength and Conductivitymentioning

confidence: 99%

“…[23] Jerman et al investigated the temperature dependence of the resistivity in Cu±Fe and found that the resistivity increased dramatically starting at around 500 C due to the large contribution of r imp . [23] They also observed that the resistivity of Cu±Fe, after furnace cooling to room temperature, remained high due to a significant amount of dissolved Fe, which did not readily precipitated from solid solution. [23] Slow cooling after heat treatment is therefore known to increase the conductivity of Cu±Fe microcomposites.…”

Section: Optimization Of Strength and Conductivitymentioning

confidence: 99%

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Copper-Iron Filamentary Microcomposites

Hong¹

2001

Adv. Eng. Mater.

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The Cu–Fe system is of particular interest because of the relatively low cost of Fe compared to other insoluble BCC phases such as Nb, Mo, Cr, and Ta. The relatively high solubility of Fe in Cu at high temperatures, coupled with the slow kinetics of Fe precipitation at low temperatures is, however, known to reduce electrical conductivity. The key to improving strength/conductivity properties is to reduce the initial dendrite size and to precipitate Fe effectively in the Cu matrix. Thermomechanical treatments have been employed by some investigators to optimize the strength and conductivity of Cu–Fe microcomposites. The study also shows that refinement of dendrites and easier nucleation of precipitates by the addition of third alloying elements can lead to improved strength/conductivity properties of Cu–Fe microcomposites.

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Section: Optimization Of Strength and Conductivitymentioning

confidence: 91%

Section: Optimization Of Strength and Conductivitymentioning

confidence: 99%

Section: Optimization Of Strength and Conductivitymentioning

confidence: 99%

Section: Optimization Of Strength and Conductivitymentioning

confidence: 99%

See 2 more Smart Citations

Copper-Iron Filamentary Microcomposites

Hong¹

2001

Adv. Eng. Mater.

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“…Lastly, Chen et al [26] found that the morphology of the eutectic phase in the Pb-Sn alloy transformed from a developed dendrite to a refined equiaxed grain under AMF. Furthermore, the application of AMF during the solidification process can also purify the melt and reduce macro-segregation and casting defects in the material [27][28][29][30][31].…”

Section: Methodsmentioning

confidence: 99%

Influences of Alternating Magnetic Fieldson the Growth Behavior and Distribution of the Primary Fe Phasein Cu-14Fe Alloys during the Solidification Process

Zeng

Liu

et al. 2018

Metals

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An alternating magnetic field (AMF) was applied during the solidification process of the Cu-14Fe alloy and the effect of the electromagnetic parameter, which impact the model and solidification technique of the solidification structure that were analyzed. Results show that an AMF applied during the solidification process significantly reduced macro-segregation and gas hole defects. During the growth process of the primary Fe phase, the AMF impacted the nucleation of detached grains and fusing dendrites. Specifically, the developed Fe dendrites were transformed to rosettes or spherical grains in the presence of an applied AMF while the grain distribution was more disperse and uniform. It was found that the growth behavior of Fe grains under AMF depended upon the combined effects of the electromagnetic force and electromagnetic heat.

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Fe–Cu Nanocomposites by High Pressure Consolidation of Powders prepared by Electric Explosion of Wires

et al. 2018

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In the present paper, preparation of nanocomposite powders of mutually immiscible Fe and Cu metals with different Fe-to-Cu ratios by electric explosion of wires and their processing into bulk materials are reported. Near-fully dense nanocrystalline Fe-Cu specimens with high compressive and bending strengths are obtained by high pressure consolidation/cold sintering of the electrically exploded powders at 3 GPa. Reduction treatment in an H 2 -flow prior to consolidation results in an intimate contact between the oxide free powder surfaces and in an excellent inter-particle bonding integrity. The Cu-rich composition exhibits an attractive combination of high strength and relatively low electrical resistivity.

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Strength and electrical conductivity of deformation-processed Cu-15 Vol Pct Fe alloys produced by powder metallurgy techniques

Cited by 73 publications

References 8 publications

Copper-Iron Filamentary Microcomposites

Copper-Iron Filamentary Microcomposites

Influences of Alternating Magnetic Fieldson the Growth Behavior and Distribution of the Primary Fe Phasein Cu-14Fe Alloys during the Solidification Process

Fe–Cu Nanocomposites by High Pressure Consolidation of Powders prepared by Electric Explosion of Wires

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