In the current study, copper nanoparticles (np-Cus) are produced on an ITO-coated glass substrate using an affordable, template-free electrochemical method using copper sulfate (CuSO4·5H2O) as a complexing agent. It has been found that the current density had a significant impact on regulating the formation of nanocrystals during electrodeposition. By carefully adjusting the electrolyte concentration in this process, copper nanoparticles of various sizes and densities were created by altering the current density. X-ray diffraction and scanning electron microscopy techniques were used to analyze the morphological.Structural evolution of copper nanoparticles as they were initially created. Structural analysis revealed the face centered cubic (fcc) crystal structure of copper. Nanoparticles grown along the preferential (111) growth orientation and crystallinity of the thin layer deposited at 1.6 mAcm−2 is improved compared to the thin layers deposited at 0.8 and 0.5 mAcm−2.The roughly 512 nm-sized, regular, homogenous, and very dense copper nanoparticles were produced directly on an ITO-coated glass substrate. The optical properties of Cu nanoparticles are strongly affected by localized surface plasmon resonance (LSPR). UV–visible analysis shows that the maximum surface plasmon peak of np-Cus generated at 1.6 mAcm−2 appears near 366 nm. The thin films around 550 nm are significantly higher compared to other thin films deposited at deposition current densities of 0.8 and 0.5 mAcm−2. Surface roughness was characterized by atomic force microscopy (AFM), in the field of catalysis. In environmental remediation, copper nanoparticles are expected to become an excellent alternative and play a vital role.