Proceedings of the IEEE 2003 Custom Integrated Circuits Conference, 2003.
DOI: 10.1109/cicc.2003.1249418
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Strategies for simulation, measurement and suppression of digital noise in mixed-signal circuits

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Cited by 13 publications
(3 citation statements)
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“…The mixed-signal circuit is designed using UMC 0.13-µm digital CMOS design kits. The published values of the packaging parasitic components are used [7], and C INT represents the on-chip interconnection capacitance to the digital ground path. The resistances of the P+ contact to the substrate are numerically simulated using Maxwell 2D SV, a commercial 2D quasistatic R, L, and C extractor from Ansoft Corp. A commercial circuit-level simulator, Spectre from Cadence Design Systems, Inc., is used for simulating the performances of the mixed-signal circuit.…”
Section: Simulation Resultsmentioning
confidence: 99%
“…The mixed-signal circuit is designed using UMC 0.13-µm digital CMOS design kits. The published values of the packaging parasitic components are used [7], and C INT represents the on-chip interconnection capacitance to the digital ground path. The resistances of the P+ contact to the substrate are numerically simulated using Maxwell 2D SV, a commercial 2D quasistatic R, L, and C extractor from Ansoft Corp. A commercial circuit-level simulator, Spectre from Cadence Design Systems, Inc., is used for simulating the performances of the mixed-signal circuit.…”
Section: Simulation Resultsmentioning
confidence: 99%
“…This chip is packaged in a 132-pin pin grid array package (PGA132M). A sense amplifier [4], [22] is located next to the DSP to measure the injected noise. All measurements were taken using a Tektronix TDS7404 4-GHz 20-GS/s oscilloscope with a pair of Cascade Microtech SG150 microprobes.…”
Section: Validation With Measurement Resultsmentioning
confidence: 99%
“…Moreover, research has been done in efficient and accurate probing of substrate noise using sensing options [16]. It has been determined, which sources of substrate noise are the dominant ones, and how different packages, interconnects, and other parasitic elements influence substrate noise coupling.…”
Section: Summary Of Previous Workmentioning
confidence: 99%