Strategies for optimizing interfacial thermal resistance of thermally conductive hexagonal boron nitride/polymer composites: A review
Pingping Jia,
Lulu An,
Lang Yu
et al.
Abstract:With the continuous development of high‐end electronic information technologies such as 5G communications, thermal management is an urgent issue in the electronic and circuit industries due to the miniaturization, functionalization and integration. Recently, polymer‐based composites with the fillers of hexagonal boron nitride (h‐BN) have been regarded as promising candidates resulting from their excellent thermal conductivity (TC), good insulation and remarkable comprehensive properties. However, the high surf… Show more
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