2020
DOI: 10.2139/ssrn.3639770
|View full text |Cite
|
Sign up to set email alerts
|

Strain, Stress and Stress Relaxation in Oxidized Zrcual-Based Bulk Metallic Glass

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1
1

Citation Types

0
2
0

Year Published

2022
2022
2023
2023

Publication Types

Select...
2

Relationship

0
2

Authors

Journals

citations
Cited by 2 publications
(2 citation statements)
references
References 0 publications
0
2
0
Order By: Relevance
“…4 reports oxidation phenomena with the formation of crystalline ZrO 2 and Al 2 O 3 followed by crystallization phase with the formation of ZrCuAl intermetallic compounds occurring for all the investigated ZrCuAl x compositions. The presence of oxides is likely due to residual O during XRD measurement, which reacts preferentially with Zr and Al due to their high O affinity [49,50]. As an example, in the case of ZrCuAl 6 (Fig.…”
Section: Thermal Stabilitymentioning
confidence: 99%
“…4 reports oxidation phenomena with the formation of crystalline ZrO 2 and Al 2 O 3 followed by crystallization phase with the formation of ZrCuAl intermetallic compounds occurring for all the investigated ZrCuAl x compositions. The presence of oxides is likely due to residual O during XRD measurement, which reacts preferentially with Zr and Al due to their high O affinity [49,50]. As an example, in the case of ZrCuAl 6 (Fig.…”
Section: Thermal Stabilitymentioning
confidence: 99%
“…However, requiring a stress-free reference is challenging, and the technique only characterizes type III residual strain. Ga + focused ion beam (FIB) and DIC method has proven reliable in measuring the timeresolved strain relaxation in titanium alloys, metallic glasses, and martensitic steels (19)(20)(21). Although it measures residual strain without a stress-free reference, two notable limitations exist, which affect residual strain measurements: (i) the accelerated Ga + ions damage the material by amorphizing, creating defects and increasing dislocation density, which is likely to induce residual stress during the Ga + FIB milling process (22), and (ii) to achieve a multiscale residual stress characterization of metallic alloys, the low removal rates of Ga + FIB usually limit the milling areas to a few micrometers, which largely achieves only type III residual stress (20).…”
Section: Introductionmentioning
confidence: 99%