1999
DOI: 10.1007/s11664-999-0222-8
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Strain relaxation mechanisms in Si1−xGex layers grown by solid-phase epitaxy: Influence of the layer composition and growth temperature

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Cited by 3 publications
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“…The magnitude of the thermal strain cannot be evaluated, because the thermal expansion coefficient of a-MnSe is unknown at present. In addition, the strain relaxation caused by the gliding of the stacking faults and the formation of the misfit dislocations has been reported in the sample grown/annealed at high temperature [12][13][14]. To investigate the effects of thermal processing for the a-MnSe epilayers, some asgrown samples were annealed at high temperature (660-800 1C) in a nitrogen atmosphere for 300 s in a rapid thermal annealing system.…”
Section: Article In Pressmentioning
confidence: 99%
“…The magnitude of the thermal strain cannot be evaluated, because the thermal expansion coefficient of a-MnSe is unknown at present. In addition, the strain relaxation caused by the gliding of the stacking faults and the formation of the misfit dislocations has been reported in the sample grown/annealed at high temperature [12][13][14]. To investigate the effects of thermal processing for the a-MnSe epilayers, some asgrown samples were annealed at high temperature (660-800 1C) in a nitrogen atmosphere for 300 s in a rapid thermal annealing system.…”
Section: Article In Pressmentioning
confidence: 99%