2007
DOI: 10.3144/expresspolymlett.2007.34
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Strain development in a filled epoxy resin curing under constrained and unconstrained conditions as assessed by Fibre Bragg Grating sensors

Abstract: Abstract. The influence of adhesion to the mould wall on the released strain of a highly filled anhydride cured epoxy resin (EP), which was hardened in an aluminium mould under constrained and unconstrained condition, was investigated. The shrinkage-induced strain was measured by fibre optical sensing technique. Fibre Bragg Grating (FBG) sensors were embedded into the curing EP placed in a cylindrical mould cavity. The cure-induced strain signals were detected in both, vertical and horizontal directions, durin… Show more

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Cited by 14 publications
(16 citation statements)
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“…12 min 7. By contrast to curing thermosets,11–13 FBG sensing does not help us to detect a gel‐like stage defined by G ′ = G ″, where G ′ and G″ denote the storage and loss shear moduli, respectively. This can be considered, however, as a strong support that the ring‐opening polymerization of CBT is entropy‐driven, indeed.…”
Section: Resultsmentioning
confidence: 97%
See 1 more Smart Citation
“…12 min 7. By contrast to curing thermosets,11–13 FBG sensing does not help us to detect a gel‐like stage defined by G ′ = G ″, where G ′ and G″ denote the storage and loss shear moduli, respectively. This can be considered, however, as a strong support that the ring‐opening polymerization of CBT is entropy‐driven, indeed.…”
Section: Resultsmentioning
confidence: 97%
“…Fiber Bragg grating sensing (FBG) is a rather new method to detect the strain build‐up. FBG was already successfully used to study the cure‐induced strain development in thermosets and thus to determine the optimum curing cycle 11–13. It is noteworthy, that the FBG technique is far more established for health monitoring of composite parts in which strain changes are caused by different failure events (e.g., Ref 14…”
Section: Introductionmentioning
confidence: 99%
“…Thermosetting materials are widely used in automotive, aircraft, electronics and sports industry [110]. Thermoset-based SMPs with high heat resistance are suitable for use in high temperature environment [111].…”
Section: Thermosetting Resinsmentioning
confidence: 99%
“…This value combines the strains due to chemical shrinkage ∆ε shr and the strains due to thermal contraction ∆ε T C . [1,4,11,12,13] Figure 3. Schematic course of curve of the strain evolution during curing and subsequent cooling.…”
Section: Resin Curing Kineticsmentioning
confidence: 99%