Stitch bond strength study in insulated Cu wire bonding

Leong, H. Y.; Yap, Boon Kar; Khan, N.; Ibrahim, Mohd Rusli; Tan, L.C.; Faiz, Muhammad Khairi

doi:10.1179/1432891714z.0000000001018

Cited by 2 publications

(1 citation statement)

References 9 publications

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“…Another group of researchers have performed study on the process optimization for fine pitch insulated Cu wire bonding with wire diameter of 20 µm. The study demonstrates that fine pitch insulated Cu wire bonding has comparable ball bond and stitch bond quality and reliability performance compared to bare Cu wire, offering great potential for high pin counts Ball Grid Area (BGA) package [3][4].…”

Section: Introductionmentioning

confidence: 98%

Analysis of Transmission Performance for Fine Pitch Interconnect

Leong

Yap

Chin

et al. 2023

SSP

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Wire bonding is the preferred interconnection in the IC packaging. Understanding the electrical performance of bonding wire as transmission line is utmost important. To date, there is very limited studies on the transmission performance of fine pitch bare bonding wire especially the insulated wires. This paper investigated the transmission performance of single bare bonding wires and insulated bonding wires with different wire material, wire diameter, bonding height, insulation thickness at high frequency. The simulation analysis shows that when the frequency increases above 15Ghz, the effect of the geometric parameters has no significant different to the transmission performance. The thickness of the insulation between 0.1μm to 0.3μm reacted similar performance for return loss and insertion loss across all frequency

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Section: Introductionmentioning

confidence: 98%