2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems 2009
DOI: 10.1109/memsys.2009.4805326
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Stiction in Low Humidity Environment

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Cited by 5 publications
(2 citation statements)
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“…A breach in hermiticity can change the gas content and pressure surrounding the MEMS device which in turns leads to performance shifts. In our previous work [1], we have found that any slight modification in the water content of the capped MEMS devices can lead to failure due to stiction. In addition, it is reported that the performance of RF MEMS switches is deleteriously affected when the devices are non-hermitically sealed due to the effect of humidity and small particles [2].…”
Section: Introductionmentioning
confidence: 98%
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“…A breach in hermiticity can change the gas content and pressure surrounding the MEMS device which in turns leads to performance shifts. In our previous work [1], we have found that any slight modification in the water content of the capped MEMS devices can lead to failure due to stiction. In addition, it is reported that the performance of RF MEMS switches is deleteriously affected when the devices are non-hermitically sealed due to the effect of humidity and small particles [2].…”
Section: Introductionmentioning
confidence: 98%
“…Ensuring hermiticity is a mandatory requirement for most encapsulated MEMS devices including automotive-grade sensors. Hermiticity failures emanates from two major sources: (1) Defects in the bonding material and (2) Cracks due to stress. A breach in hermiticity can change the gas content and pressure surrounding the MEMS device which in turns leads to performance shifts.…”
Section: Introductionmentioning
confidence: 99%