2019 IEEE 4th International Conference on Integrated Circuits and Microsystems (ICICM) 2019
DOI: 10.1109/icicm48536.2019.8977162
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Steady-State Thermal Simulation of the InP HBT Device Heat Spreading in DAHI Chip

Ming Wang
1
,
Youtao Zhang
2
,
Xiaopeng Li
3
et al.
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