Steady-state heat conduction analysis for two-terminal microwave oscillator devices with rectangular integral heat sinks

Postoyalko, V.

doi:10.1098/rspa.1995.0132

Cited by 3 publications

(2 citation statements)

References 3 publications

(3 reference statements)

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“…The temperature-dependent thermal conductivity of diamond IIa is given as , where W cm K and 1.26 [9]. For pure copper, the temperature dependence of thermal conductivity is modeled as where 0.00069 Wcm K and 4.21429 Wcm K [1], [2]. Plots of thermal conductivity of diamond IIa and pure copper against temperature are shown in Fig.…”

Section: The Examplementioning

confidence: 99%

“…Batchelor [1] calculated the temperature distributions of 1070-9886/97$10.00 © 1997 IEEE cylindrical heat dissipation system for microwave oscillators using this linear continuity equation without any justification. In a later paper, Batchelor and Postoyalko [2] extended the same approach to rectangular gold heat spreaders with circular surface heat source.…”

Section: Introductionmentioning

confidence: 99%

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On the effect of nonlinear boundary conditions for heat conduction in diamond heat spreaders with temperature-dependent thermal conductivity

Peng

Tan

1997

IEEE Trans. Comp., Packag., Manufact. Technol. A

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For steady-state heat conduction in diamond heat spreaders with temperature-dependent thermal conductivity, we examine the valid range of the commonly used approximate solution against a rigorous solution which we have recently formulated. The basic difference between our work and the approximate solution lies in the boundary condition (bc) of the transformed temperature over the spreader-sink interface-we use a nonlinear bc whereas the bc in the approximate solution has been assumed to be linear. We point out that the valid range of the approximate solution is determined by the temperature difference above the ambient over the interface. The discrepancy between the two solutions becomes severe (>10%) for devices of radius around 50 m involving high power dissipation (>20 W).Index Terms-Diamond heat spreader, microwave diode package, temperature-dependent thermal conductivity.

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Section: The Examplementioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

On the effect of nonlinear boundary conditions for heat conduction in diamond heat spreaders with temperature-dependent thermal conductivity

Peng

Tan

1997

IEEE Trans. Comp., Packag., Manufact. Technol. A

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Nonlinear thermal analysis of a rectangular diamond IIa heat spreader used for microwave power devices

Peng

Tan²

ITherm'98. Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.98CH36208)

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A Rigorous Series Solution for Diamond Heat Spreaders with Temperature-Dependent Thermal Conductivity Used in Microwave Power Devices

Peng¹,

Tso

Tan³

1996

Jpn. J. Appl. Phys.

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In this paper we derive a rigorous series solution of the nonlinear heat transfer equation using the modified Kirchhoff transformation for a cylindrical diamond heat spreader with temperature-dependent thermal conductivity, situated on the top of a copper heat sink. We point out what we believe to be errors in two analytical approaches applied to the same problem which were published recently [Proc. R. Soc. Lond. A 441 (1993) 181; Proc. R. Soc. Lond. A 445 (1995) 375; and IEEE Trans. Microwave Theor. & Technol. 42 (1994) 573]. The basic difference between our work and these previous studies lies in the boundary condition (b.c.) of the transformed heat potential over the spreader-sink interface–we use nonlinear b.c. whereas the boundary conditions in the previous studies have been assumed to be linear. Calculations of change in the thermal resistance with the geometrical dimensions of the spreader, the input power, and the ambient temperature show up the profound influence which the assumed b.c. have on the problem. Our study has also revealed errors in numerical results presented in another paper [IEEE Semi-Therm Proc. (4th Annu. Semiconductor Thermal and Temperature Measurement Symp.), p. 113].

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Steady-state heat conduction analysis for two-terminal microwave oscillator devices with rectangular integral heat sinks

Cited by 3 publications

References 3 publications

On the effect of nonlinear boundary conditions for heat conduction in diamond heat spreaders with temperature-dependent thermal conductivity

On the effect of nonlinear boundary conditions for heat conduction in diamond heat spreaders with temperature-dependent thermal conductivity

Nonlinear thermal analysis of a rectangular diamond IIa heat spreader used for microwave power devices

A Rigorous Series Solution for Diamond Heat Spreaders with Temperature-Dependent Thermal Conductivity Used in Microwave Power Devices

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