“…Based on the dimensions of the top Si plate, the microsprings and the bonding layer of polyset, the effective mass of the vibration system was approximated by the mass of the silicon plate (m* = 268 mg). The total number of microsprings acting in parallel for this particular system, N was estimated to be 3.33×10 6 . From the nanoindentation experiments, the elastic spring constant, k, of the individual spring was determined to be k =21±5 N/m.…”
Section: Figurementioning
confidence: 99%
“…Most of the current MEMS or NEMS elements are made of Si microstructures that inherit the advantages of fabrication by planar processing techniques used in silicon microelectronic technology [5][6][7]. The use of microstructures made of polymers such as parylene as elements of MEMS or NEMS is less developed to date [8,9].…”
A mechanical vibration system was made by sandwiching an array of parylene-C microsprings between two flat plates of Si. This system was driven mechanically in forced oscillation using a piezo transducer attached to the bottom Si plate. An atomic force microscope was used to record the displacement of the top plate in both the contact and non-contact modes. At the resonance, the system was observed to give large vertical displacement amplitude of up to 100 nm with a Q-factor of up to 900.
“…Based on the dimensions of the top Si plate, the microsprings and the bonding layer of polyset, the effective mass of the vibration system was approximated by the mass of the silicon plate (m* = 268 mg). The total number of microsprings acting in parallel for this particular system, N was estimated to be 3.33×10 6 . From the nanoindentation experiments, the elastic spring constant, k, of the individual spring was determined to be k =21±5 N/m.…”
Section: Figurementioning
confidence: 99%
“…Most of the current MEMS or NEMS elements are made of Si microstructures that inherit the advantages of fabrication by planar processing techniques used in silicon microelectronic technology [5][6][7]. The use of microstructures made of polymers such as parylene as elements of MEMS or NEMS is less developed to date [8,9].…”
A mechanical vibration system was made by sandwiching an array of parylene-C microsprings between two flat plates of Si. This system was driven mechanically in forced oscillation using a piezo transducer attached to the bottom Si plate. An atomic force microscope was used to record the displacement of the top plate in both the contact and non-contact modes. At the resonance, the system was observed to give large vertical displacement amplitude of up to 100 nm with a Q-factor of up to 900.
“…If the size of the gap is comparable with the wavelength of light, then part of the radiation passes (tunnels) through the gap into the second medium and the reflection coefficient of the structure "medium-gap-medium" decreases. Thus, the power of optical radiation reflected from the structure "medium-gap-medium" carries information about the magnitude of the change in the gap and the measured angular velocity [5][6][7][8][9][10]. When developing an angular velocity transducer, it is necessary to have an adequate description of the real transfer function of the module based on the optical tunnel effect (MOTE), depending on the size of the nano-displacements of the resonator when the measured angular velocity is applied.…”
This article presents an experimental investigation of the characteristics of the module based on the optical tunneling effect, which provides information on the nano displacements resonator of the angular velocity transducer. The analysis of the sensitivity of the module based on the optical tunneling effect with increasing amplitude of forced displacements excited by a piezoelectric module is produced. The principle of operation of the module based on the optical tunneling effect, which is based on the dependence of the reflection coefficient of the radiation source structure "medium-gapmedium" on the size of the gap, is determined. The transfer function of the piezoelectric transducer based on the optical tunneling effect with the total optical losses is determined. The theoretical investigation of the transfer function based on the tunneling effect using the module "optical prism-medium-surface simulator of the edge of the ring resonator" is carried out. The results of the experimental investigation are confirmed that when the amplitudes of the input voltages increase, asymmetric amplitudes of the positive and negative half-waves of the output voltages of the module based on the optical tunneling effect are formed. The scheme of the experimental investigation of the transfer function of the module based on the optical tunneling effect, providing the implementation of optical information retrieval in the measurement of angular velocity, is described. The results of the experimental investigation of the optical information sensing unit at different signals of the wave generator show a good agreement with the theoretical model of the module based on the optical tunneling effect and a small change in sensitivity with increasing the angular velocity and amplitude of the displacement of the resonator edge simulator, which should be compensated for the formation of the output signal.
“…The most important feature of MEMS is the precision fabrication of moving elements of mechanical structures (earlier inaccessible in mechanics) and their unification in one technological cycle with controlling and processing electronic elements created on the basis of CMOS technology. MEMS applications include the following areas (Kostsov, 2009): -microoptoelectromechanics (displays, adaptive optics, optical microswitches, fastresponse scanners for cornea inspection, diffraction gratings with an electrically tunable step, controlled two-and three-dimensional arrays of micromirrors, etc. ); -high frequency (HF) devices (HF switches, tunable filters and antennas, phased antenna array, etc.…”
Section: Introductionmentioning
confidence: 99%
“…Micro-Electro-Mechanical Systems (MEMS) are devices that display the most intense development in modern microelectronics (Kostsov, 2009). The main challenge of microelectromechanics is the design of unique micromechanical structures for various purposes.…”
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